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July 2013

Caliber Interconnect Announces PCB Thermal Analysis Services

the pcb size is getting reduced and the operating parameter of densely populated boards are keep increasing which poses thermal effects in the boards and substrates. it eventually affects performance of the interconnects. the increase in component density in a reduced size of pcb and the corresponding increase in power causes excessive heat which lowers the overall electrical performance and reliability. caliber interconnects uses different thermal analysis tools to foresee the factor affecting interconnect performance and proposes cost effective solutions to overcome deep thermal effects by analyzing thermal boundary conditions and power dissipation.


goals of caliber's services

  • prevent the performance error, component or system damage due to excess temperature on circuit boards.

  • a printed circuit board contains organic and inorganic materials with internal and external wiring, which allows electronic component to be physically supported and electrically connected. at times there are greater requirement for power handling and cooling capabilities to achieve expected performance.

  • temperature exceeding the maximum operating limit may result in irreversible changes in the component operating characteristics.

  • performing precise thermal analysis helps us to increase component reliability, ensure proper material selection, reduce the possibility of the thermal failure and guarantee the electrical performance.


to learn more about caliber's pcb themal analysis services please click to: caliber interconnect solutions

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