thermal interface material is an important part of an overall thermal management strategy.  each project needs to be carefully analyzed to determine the right solution. today's solutions work well but what about tomorrow's next project to handle dual-core, quad core or eight-core processors?   at coolingzone 2013 we've got a focus on thermal interface material with three excellent speakers over the summit's 3-days.

dr. richard hill, ph.d. of laird technologies will be discussing not just the roadmap of tim to learn where we've been and what is ahead, but also addressing important questions such as:  the challenges with non-silicone tim’s – softness and stability; is higher thermal conductivity the answer or the problem?  contact resistance is the next real hurdle to overcome for thermal performance; meeting tim 1 reliability requirements with a new technical approach; and much more.   read his entire abstract here, "dr. richard hill to speak at coolingzone-13 on 'meeting the challenges facing thermal materials suppliers through a new approach to technology, innovation, and intellectual property'”.

dr. philip blazdell, t-global technologies will speak on "passive thermal management - challenges and directions for a lower cost of ownership solution".

bill pfeifer, sp3 diamond will address "the commercial use of diamond heat spreader material for thermal management/heat transfer challenges".

to learn more and to register visit this link today:  coolingzone-13 october 21-23, 2013, boston ma