coolingzone 2013 will feature a number of topics on advanced thermal management. two of those feature dr. mark hodes of tufts university and dr. lee poh seng of the national university of singapore. dr. hodes is presenting results of experiments with galinstan-based cooling of microelectronics and how to apply them. dr. lee wil be presenting findings and applications of oblique fin micro-/mini-channel heat sinks.
dr. hodes talk will show that in galinstan-based cooling, the dominant contribution to thermal resistance is caloric rather than convective. indeed, on account of the thermophysical properties of galinstan, the increase in the bulk temperature of it across microchannels exceeds wall-to-bulk temperature differences. based upon this notion we will show that the thermal resistance of galinstan-based cooling can be further reduced by utilizing engineered structured surfaces to suspend galinstan on roughness features etched into the microchannel walls. this introduces a lubricating-air layer between the galinstan and microchannel walls thereby reducing flow resistance. the net result of the air layer is decreased caloric resistance, increased convective resistance and, most importantly, decreased total resistance. click here to read the full abstract of his talk at coolingzone-13.
dr. lee's talk will focus on the real world application of “oblique fin liquid technology” which promises to control thermal issues that have plagued lithium ion batteries. battery packs that use lithium-ion cells such as those found in laptops and in electric cars, for example, can suffer from cells failing due to overheating. this can cause a chain reaction with neighboring cells with disastrous results such as explosions. the technology relies on cooling plates. said dr lee, “the oblique fin technology can achieve 30 to 50 per cent better results compared with conventional liquid cooling, but still using the same amount of energy.”
coolingzone-13 is being hosted by granite links golf club and conference center, october 21-23, 2013. for all information and registration please click to this link: coolingzone-13 thermal management summit web page.
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