future facilities ltd, the global leader in software for data center design and operational management is pleased to announce their attendance at semi-therm 25 where they will unveil 6sigmaet, a 3rd generation cfd-based software for electronics thermal design and the first major breakthrough for a thermal design tool in 10+ years!��
6sigmaet will feature a highly efficient modeling and analysis environment that will significantly improve analysis-based thermal design from concept to final implementation.�� in addition, 6sigmaet will be a key module of the 6sigmadc suite of software design tools that addresses the trend toward integrated design of it equipment, cabinets and data centers.
��
visit the future facilities booth at semi-therm 25 to witness the public unveiling of 6sigmaet.�� ��attend the future facilities vendor session to view a live demonstration of 6sigmaet and learn about a new, innovative take on electronics cooling design and the importance of design chain integration from the��box to the data center.�� 6sigmaet breaks the mold in the following areas:
modern, state-of-the-art user interface that combines powerful cfd-analysis and first-rate mcad functionality
the most intelligent and complete set of modeling objects for fast, precise model creation
fully automated, object-awaregridding
integrated version management
handles rotated and angled geometry (angled dimms!)
direct and intelligent import of idf & stl data
fast, efficient, robust solver
6sigmaet is based on 6sigmadc, future facilities�€™ robust, field-proven software for data center design.�� 6sigmaet and will bring new levels of modeling automation and productivity to the market after a long period of minimal change in the market for electronics cooling design software.
visit the future facilities�€™ website to register to receive information about 6sigmaet in advance of the launch announcement at semi-therm.�� each registrant will be entered into a drawing to win a nintendo wii!�� winners will be announced at the future facilities booth on wednesday, march 18.�� winners must be present to win.��
a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats) will give you the most comprehensive and up-to-date source of information about the thermal management of electronics
if you have a technical article, and would like it to be published on coolingzone please send your article in word format to [email protected] or upload it here