cool innovations' heat sinks for power bricks and other power components are an excellent choice for power supply cooling. cool innovations' pin fin heat sinks outperform the majority of other heat sink technologies by a substantial margin due to their advanced design. the pin fin heat sinks produce very low thermal resistances due to the round nature of the pins, large surface areas and an omnidirectional configuration.
solutions are available in two designs, each optimized for a specific airspeed environment:
- sparsely configured pin fins are designed for airspeed environments ranging from 0 to 400 lfm
- densely configured pin fins are designed for airspeed environments ranging from 400 to 800 lfm and for impingement cooling (fan placed directly on top of the pins)
highly sophisticated and flexible manufacturing processes allow for a high degree of customization. cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device. standard pin fins for power devices range from a footprint of 2.4" x 2.4" to a footprint of 9.8" x 9.8" and from a height of 0.6" to a height of 1.7". for more information, click to, cool innovations power brick and power supply heat sinks.