Coolingzone.com - Thermal Management of RF and Digital Electronic Assemblies using Optimized Materials and PCB Designs

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John O | March 2012

Thermal Management of RF and Digital Electronic Assemblies using Optimized Materials and PCB Designs

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in this article by sandy kumar, ph.d. director of technology, american standard circuits, inc., discusses the importance of thermal management in general and the specifically with regards to rf. rf is an area of extremely high heat and dr. kumar's white paper describes how to best approach cooling this technology using optimized materials and pcb designs.

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