why would we at coolingzone be delighted to see yet another article on thermal management?  the simple answer is, as the author of the article in pcb007 states:

that in any electronic device, its performance, reliability, efficiency, and life expectancy are related inversely and exponentially to the magnitude of increased temperature above its optimum operating range. as the semiconductor transistor junction temperature rises, its life cuts down exponentially.

sandy kumar, ph.d., american standard circuits, inc., does a good job of explaining the why and the how of designing a thermal management solution with these products in mind.  he covers important topics such as:

• high temperature scenarios
• low temperature scenarios
• thermal interface materials
• thermal resistance
• thermal time constants

it is well worth a read, particularly if you are in the rf or digital electronic assembly space.

to read the full article, click the green more link to the right:

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