according to north carolina state university researcher jag kasichainula, the thermal conductivity of both his copper-graphene composite, which is attached to the electronic device, and the indium-graphene interface film, are higher than copper, and yet are cheaper due to the exscalating price of copper. the copper-graphene composite can be deposited in films as thin as 200 microns, according to the effective medium approximation (ema) method of modeling thermal conductivity and determining the interfacial thermal conductance between copper and graphene. the full article is worth a read, especially the comments. see it at ee times, "graphene composite beats copper for cooling chips"
coolingzone sponsor advanced thermal solutions did a study comparing graphene, copper and aluminum in 2010 and didn't find appreciable differences. coolingzone readers can see that study at ecn magazine here, comparing the impact of different heat sink materials on cooling performance
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