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John O | October 2012

Limited Seating for October 31st CoolingZONE eConference Covering Breakthrough Pin Fin Heat Sinks and Best Practice in LED Thermal Characterization


coolingzone's econference series is being kicked off october 31.  the series feature monthly online training taught by world class experts in thermal management and heat transfer.  each month two to three hours of important topics in thermal management, heat transfer, electronics cooling and thermal transport are provided for $99.00 $49.00 for a month's sessions.  these webinar format elearning courses fit well for engineers who need to review and update their skills or for those engineers moving into a new position.  the $99.00 $49.00 fee include an unlimited access to the recorded versions and the speaker notes (when provided by the speakers).  econference topics and speakers are in place for october, november and december:


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price reduced to $49.00 if you register by october 30th

 

topics for october 31, 2012  11am-1pm (est)

satish_kandlikar_300  dr. satish kandlikar:
numerical analysis of novel micro pin fin heat sink with variable fin density"

numerical analyses to characterize and design micro pin fin heat sinks for cooling the 2016s ic chip heat generation are carried out in this paper. a novel design with variable fin density is proposed to generate a more uniform temperature of the ic chip junctions. the variable-density feature allows the gradual increase of the heat transfer area as coolant passes through the system. single-phase water in the laminar regime is employed. four different fin shapes (circle, square, elliptical, and flat with two redounded sides) are analyzed. the junction temperature and pressure drop variations in the heat sink generated by these shapes are presented. the effects of varying the fin length and height are also studied. the best heat sink configuration has a thermal resistance ranging from 0.14 to 0.25 k/w with a pressure drop lower than 90 kpa and a junction temperature ~ 314 k under the conditions studied. the temperature gradient at the bottom wall of the heat sink is considered as a parameter for comparing various heat sink designs. the novel cooling device has an overall temperature gradient lower than 2°c/mm, which is significantly lower than the temperature gradients in other schemes reported in literature.

 

ne_photo_450  norbert engleberts:
"led experimental thermal characterization"

in today's electronics industry, there is a constant push to have more functionality in a smaller volume. the dissipated power per function is decreasing, but more and more functions will be put within a smaller volume. ic's, asics, leds are becoming more and more powerful and the thermal load per surface area and volume is increasing. as the result, thermal management of electronics and in particular led has taken the centre stage for their successful implementation. the presentation will discuss the combination of analytical modelling, computational modelling and experimental testing to help the designer to come up with the most optimal solution and how the final product need to be verify by thermal characterisation and measurements and the challenges involved in doing this. participants will get an understanding of the methods available to perform accurate thermal characterization and measurement on led products and understand the need for using experimental testing next to analytical and computational modeling


topics for november 28, december 12 (11am-2pm est)

date topic speaker
november 28, 2012 registration thermal design and characterization of flat miniature heat pipes dr. kaveh azar
november 28, 2012 registration fast 3d data center cooling analysis jim vangilder
november 28, 2012 registration when is computer aided engineering more than just pretty pictures? dr. andrew duggleby
december 12, 2012 registration sense and nonsense of correlations dr. clemens lasance
december 12, 2012 registration system chassis materials for thermal management: choices and tradeoffs dr. carl zweben
december 12, 2012 registration review of emerging cooling options for next gen data centers dr. michael ohadi

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