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John O | December 2012

Using Your Lungs as a model, GE Creates New Air Mover Method That Cools Electronics at the Source


ge's new invention, the “dual piezoelectric cooling jet" is an impressive bit of engineering in a very small package.  we first reported on this technology development in our press release section but seeing it in action is even more impressive.  and such a small air mover as this has never been more impressive.

ge-dual-cooling-jets-prototype_606

ge's device name, dcj has the following specifications, making it a powerful option for thermal management applications almost immediately:

  • 4mm tall height
  • it consumes less than 1/2 the power of a comparable fan or cpu cooler. 
  • can be applied to a variety of form factors,
  • no moving parts

dcj_2_1266


ge is currently providing dcj demonstration kits for oems wishing to evaluate the dcj technology for their next generation products. in addition, ge has licensed the dcj technology to fujikura ltd, (www.fujikura.co.jp ) a world leader in thermal management solutions, known for their reliable and innovative products serving the telecom, automotive, energy, and electronics markets.

ge's team has published a research paper on this topic as well, that covers the science behind their work.  here is the abstract:


in recent years, electronics have significantly reduced in size at maintained or increased functionality. this trend has led to an increased demand for more capable thermal management solutions at smaller scales. however, miniaturization of conventional fan and heat sink cooling systems introduces significant size, weight and efficiency challenges. in this study the flow performance of a novel thin form-factor cooling solution, the advanced dual piezoelectric cooling jet (dcj), is evaluated. a dcj is a micro-fluidic device that disturbs the boundary layer over a hot component and hence increases heat transfer. the design of an equivalent fan-curve experiment is described in detail. a first ever fan curve for a bimorph dcj device is presented. this is coupled to a thermal performance analysis using an experiment simulating thin profile consumer electronics.

 

to get a copy, click to ieee explore


ge has a video out, which does a reasonably good job of showing the technology in action.   click the image below to see it:

 

Choose category and click GO to search for thermal solutions

 
 

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