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John O | January 2013

Aluminum and Copper Hybrid Strategies for Thermal Management


we wanted to highlight an article over on electronics news that caught our eye this morning.  the article, "al clad cu wire bonds extend operation temperature range" offers a nice overview of this topic of using aluminum with copper, in the context of that article, it is specifically about aluminum clad copper wire bonds.  but are there other applications for this strategy?  the answer is of course yes, and we want to note a few other articles to our readers.

first, up an article here at coolingzone entitled, "industry developments, thermally conducitve pcb's" in which coolingzone sponsor ats writes about the use of both al and cu in pcb's, among other materials.  the goal being to really best leverage the pcb as part of an overall thermal management strategy.

second, a practical, real world approach to this.  wolverine’s microcool® division  has released, just in 2012, new products that incorporate this approach as well.  microcool®-clad™, provides igbt module manufactures with a product that has the heat spreading capability of copper and the lightweight, lower cost and additional reliability afforded by an aluminum pin structure in the fluid chamber.


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