jaro thermal's new (maintenance free) ultra-slim heatpipes use water as a "working fluid" that continually alternates between evaporation and condensation. this constant cycling of water to vapor micro-sized ultra-slim heat pipes is caused by a high-capillary mesh wick inside of the heatpipe. as the vapor travels away from the heat source, it cools and undergoes a phase change of condensation. once the water is formed, the mesh wick captures the water and travels back down the wick to the heat source. as the water approaches the heat source, it undergoes a phase change of evaporation. the high-capillary mesh wick allows for cooling capacities that range from 5w up to 35w.

the minimum achievable thickness in the heatpipe is 0.6mm, which makes it perfect for most confined-space requirements. in addition, the heatpipes are bendable, and can be pressed (for different height options). they can be ordered in different thickness levels, in either copper or aluminum. applications include led modules, tablet pcs, mobile phones and other electronic devices that require cooling within extreme space limitations. specific examples include intel's new low voltage chips, which run at 17 watts of power (in their next-gen ultra-book).


for more information about these "next generation" heat pipes, please click to jaro thermal or contact dennis eisen [email protected] (561-241-6700561-241-6700 x307).

click the following image to down load the jaro thermal slim heat pipe design guide: