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April 2015

Versarien Technologies' Launches First Range of 10 Low Profile Air Cooled Heat Sinks


april, 2015 - versarien plc’s subsidiary, versarien technologies limited, has launched a brand new range of 10 low profile air cooled heat sinks using the material versariencu. this is the first ‘off the shelf’ thermal management solution released by versarien technologies and offers added performance in low profile applications for passive cooling environments.

the heat sink builds upon a number of customer-specific and innovate-uk product development projects, which have enabled a range of applied testing programs. the heat sinks are created under its exclusive licence to manufacture microporous copper foam, which dramatically improves the thermal management of components. the large surface area created by the interconnected pores of the versariencu foam coupled with the thermal conductivity of copper allows either for the height of the heat sinks to be reduced; or improved thermal performance in the same physical envelope.

versariencu is the result of metallurgy research performed at the university of liverpool’s department of engineering. it allows the creation of metallic materials with fine, open, interconnected pores that emulate structures commonly found in nature. this unique structure promotes thermal transfer levels that surpass anything that was previously possible.

for further performance gains, the copper foam is coated with a thin, hard layer of high temperature copper oxide. this improves the emissivity of the foam to increase its radiant properties and reduces the temperature of the component. testing shows that these heat sinks can outperform their comparable competitors by up to 6ºc/w, making this new range a major breakthrough in thermal management.

this range is designed for use in passive cooling applications where space is at a premium and performance is crucial. versariencu heat sinks can be used to cool any integrated circuit component. applications include power integrated circuits, high temperature components and transistors, set top boxes, ap routers, cable modem and broadband, optical networks and led tv and flat panel displays.

versarien technologies low profile heat sinks will create overall cost savings for electronics customers globally with their proven ability to outperform competitors in applications where space is at a premium. the products are competitively priced and the improved thermal management capabilities over traditional heat sinks have already resulted in  interest from large scale users, who are looking for more reliability and functionality for their electronic components.

versariencu reduces the potential size requirement of individual components due to increased thermal efficiency up to 6ºc/w cooler. where space has traditionally been at a premium the metallic foam now allows for a reduced footprint. designers are excited to understand how versarien technologies’ products can help them improve upon the limitations of previous designs.

versarienhs_271

for more information go to:www.versarien-technologies.com

about


founded in 2010, versarien utilises proprietary technology to create innovative new engineering solutions that are capable of having a game-changing impact on a broad variety of industry sectors.

contact

versarien™ plc (headquarters)
building 4
vantage point business village
mitcheldean
gloucestershire gl17 0dd

email: info@versarien.com

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