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April 2015

Fujipoly Highlights Sarcon SPG-30A Ultra Low Compression Thermal Gap Filler

fujipoly's sarcon spg-30a is an ultra-low compression gap filler compound.  it is an easy to handle, high viscosity thermal silicone that is idea for filling large gaps between delicate circuit board components and a heat sink.  one of the key benefits of the compound is that it required minimal compression force.


key specifications:

  • thermal resistance: 0.3 °cin2/w
  • thermal conductivity: 3.2 w/m°k
  • operating temperature: -40°c to 160°c
  • conforms to almost any component shape
  • protects fragile solder points
  • remains form stable without heat curing

for more information, visit:  fujipoly sarcon thermal management components

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