design of
liquid cooling systems what every thermal design engineer needs to
know
this short course presents a birds-eye view of liquid cooling
technology. while liquid cooling is not at all new, most civilian electronics
cooling applications have been air cooled for the last couple of decades. what
does it take to plan, design, and implement a liquid cooling system where air
cooling is reaching its performance limits? what is available in the industry
today, and what should customers be asking for?
topics will include design considerations for when to switch from air
cooling to liquid cooling; interface resistivity and its role in the overall
system; data format requirements for cold plate characterization; system level
optimization; modeling tools for liquid cooling; and practical implementation of
a liquid cooled system.
who should attend:
thermal design engineers and technology managers who need to get up to
speed quickly on the capabilities, requirements, and pitfalls of liquid cooling.
an engineering background and familiarity with spreadsheet calculations is
assumed.
course outline
topic 1: from air to liquid cooling: when to
switch acoustic noise considerations performance space
requirements single phase vs two phase
topic 2: interface resistivity requirements at high heat
flux current state of the art – what are people doing in practice? where
to look for latest developments
topic 3: cold plate characterization – performance data
requirements power map effects temperature “markers” effective heat
transfer coefficient over specific area function of flow rate?!
topic 4: system level optimization – liquid loop
analysis
topic 5: modeling tools & where to use them cfd/fea –
chip level: power map, spreader optimization spreadsheet – liquid loop,
effective heat transfer coefficient correlations – which ones work for
liquids?
topic 6: practical implementation hardware
requirements connectors, tubing heat exchanger pump control systems;
time constants of system components vs control system monitoring time
constants
instructor: dr. cathy
biber
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cathy biber, is wearer of all hats
in her consulting practice. she has extensive experience in electronics cooling,
as well as background in other heat transfer applications like power
electronics, digital projection systems, and thermal processing equipment. her
career has included stints in the corporate world at ibm, wakefield engineering,
and infocus, and in the academic environment at portland state university; she
also holds a ph.d. from mit. she enjoys finding creative thermal solutions to
address many disparate product design
requirements. |
course fee: $595 ($395 for summit 2005 attendees)
date: august 19, 2005
location: crowne plaza hotel
1360 worcester street
natick, ma 01760
1-800-227-6963 for registration and more information on the summit visit www.coolingzone.com/summit2005
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