design of liquid cooling systems
what every thermal design engineer needs to knowthis short course presents a birds-eye view of liquid cooling technology. while liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades. what does it take to plan, design, and implement a liquid cooling system where air cooling is reaching its performance limits? what is available in the industry today, and what should customers be asking for? topics will include design considerations for when to switch from air cooling to liquid cooling; interface resistivity and its role in the overall system; data format requirements for cold plate characterization; system level optimization; modeling tools for liquid cooling; and practical implementation of a liquid cooled system. who should attend: thermal design engineers and technology managers who need to get up to speed quickly on the capabilities, requirements, and pitfalls of liquid cooling. an engineering background and familiarity with spreadsheet calculations is assumed. course outline topic 1: from air to liquid cooling: when to switch
acoustic noise considerations
performance
space requirements
single phase vs two phase topic 2: interface resistivity requirements at high heat flux
current state of the art – what are people doing in practice?
where to look for latest developments topic 3: cold plate characterization – performance data requirements
power map effects
temperature “markers”
effective heat transfer coefficient over specific area
function of flow rate?! topic 4: system level optimization – liquid loop analysis topic 5: modeling tools & where to use them
cfd/fea – chip level: power map, spreader optimization
spreadsheet – liquid loop, effective heat transfer coefficient
correlations – which ones work for liquids? topic 6: practical implementation
hardware requirements
connectors, tubing
heat exchanger
pump
control systems; time constants of system components vs control system monitoring time constants instructor: dr. cathy biber | cathy biber, is wearer of all hats in her consulting practice. she has extensive experience in electronics cooling, as well as background in other heat transfer applications like power electronics, digital projection systems, and thermal processing equipment. her career has included stints in the corporate world at ibm, wakefield engineering, and infocus, and in the academic environment at portland state university; she also holds a ph.d. from mit. she enjoys finding creative thermal solutions to address many disparate product design requirements. |
course fee: $595 ($395 for summit 2005 attendees) date: august 19, 2005 location: crowne plaza hotel 1360 worcester street natick, ma 01760 1-800-227-6963 for registration go to https://www.coolingzone.com/summit2005 | 
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