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April 2017

Fujipoly offering new thermal interface material with low thermal resistance

fujipoly sarcon gr25a-0h2-30gy is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides.


this special treatment dramatically reduces material tearing and damage during assembly and rework operations. the new formulation efficiently fills air gaps between components, board protrusions and recessed areas to increase surface contact with a heatsink and improve its cooling performance.


  • thermal resistance: 0.21°cin2/w
  • low pressure: 14.5 psi
  • thermal conductivity: 2.8 w/m°k*
  • thickness: 0.3mm
  • pre-cut sheets: 200mm x 300mm (max.)


*per astm d2326


find out more at http://www.fujipoly.com.

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