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May 2017

Laird Active transceiver coolers enable high data transmission speeds


laird has developed a new platform of customizable teas specifically designed for thermal management in sfp transceivers.

 

optical transceivers are used in communication equipment to transmit data at distances up to 1km away for outdoor applications. each unit contains a temperature sensitive laser diode, and the ability to transmit data at higher speeds depends on keeping the temperature typically below 70°c.

 

the thermoelectric-based atc series removes heat from the optical module to maintain peak performance and minimize loss in packets of information. the atc line has been optimized to remove heat from three types of transceivers: sfp, xfp and qsfp.

 

the upcoming deployment of 5g networks, in addition to increased data traffic on established lte and lte-advanced networks, is pushing the demands for higher data rates to ensure qos for mobile device users. however, faster data communications present significant thermal challenges for critical components such as optical transceivers.

 

these devices are installed in outdoor radio units to transmit and receive data from the base station. the temperature of these devices, particularly in outdoor environments, increases due to smaller form factors and no forced airflow, which raises the amount of heat radio units need to dissipate.

 

this results in high temperatures that exceed the maximum operating limit of the optical transceiver that requires an active cooling solution.

 

“the traditional thermal solution for the sfp is passive, containing an interface material attached to a bulky heat sink that dissipates heat through natural convection. this type of cooling has had difficulty rejecting heat into the ambient environment for radio units in lte and upcoming 5g systems,” said anders kottenauer, senior vice president of laird’s engineered thermal systems business.

 

“laird’s new atc series of miniature form factor thermoelectric assemblies provide an innovative way to remove heat from critical optical components that operate in high temperature environments. this improves reliability of data transmission and reduces latency.”

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