advanced thermal solutions, inc. (ats), a leading-edge engineering and manufacturing company focused on the thermal management of electronics, has pin fin heat sinks with higher performance per gram than other competitors on the market.

electronics packages are numerous and range from bga, qfp, lcc, lga, clcc, tsop, dips, lqfp and many others. ats offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. 

the cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape.

pin fin features & benefits

• high efficiency pin fin design provides low pressure drop characteristics
• large surface area increases heat sink performance
• fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps cost low
• comes standard without interface material, or with most common pressure sensitive thermal tapes as a custom option