the ever-increasing demand for higher bandwith means faster and denser switches, servers and data centers. all of that speed and energy requires new methods for keeping everything cool.  te connectivity is providing a new thermal management solution with a new generation of input/output (i/o) connectors.

(wikimedia commons)

adding more and more connectors will only contribute to the thermal load on the system and could overheat, so to dissipate the heat te connectivity engineers found a solution using its microqsfp and “integrating the heat sink into the transceiver or plug rather than the cage.” this provided a significant improvement to the thermal capacity over current interfaces.

according to lucas benson, global product manager, “integrating the heat sink in the i/o module allowed te engineers to reduce the thermal path significantly while also turning each plug and cage location into increased airflow for the unit.”

learn more about this solution by clicking http://www.te.com/usa-en/products/connectors/pluggable-connectors-cages/microqsfp/smaller-faster-cooler.html.