advanced thermal solutions, inc. (ats) has a line of blueice™ ultra low profile heat sinks that are designed for high performance in low air velocities.

in many electronics systems, such as telecomm, datacomm, biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. electronics packages such as bga, qfp, lcc, lga, clcc, tsop, dip, lqfp are commonly used with stringent thermal requirements in a tight space with limited airflow.

ultra low profile heat sinks offered by ats range from 2-7 mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. their thermal resistance is as low as 1.23° c/w within an air velocity of 600 ft/min.

blueice™ heat sinks are very lightweight, ranging from 4 to 30 grams. no mechanical hardware is needed to mount them to components. a double-sided, thermal conductive adhesive tape can be used to attach a blueice heat sink securely. this feature reduces weight and assembly time, while saving valuable board space.

blueice™ low profile heat sinks are applicable with components from altera, amd, freescale, intel, ti, xilinx and many more.

blueice™ ultra low profile features & benefits

• blueice™ heat sinks feature an ultra low profile for tough-to-cool applications
• designed for high performance in low air velocities
• ideal for telecommunications applications where space is limited
• comes pre-assembled with high performance thermal interface material

for more information about blueice™ heat sinks or any ats products, contact [email protected].