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December 2005
library  >  PAPERS  >  Theoretical/General

Status Report on EU project DELPHI


the accurate prediction of the operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack of reliable, standardised input data. the delphi project is addressing this problem by the development and experimental validation of thermal models of a variety of `generic' electronic parts.

 

delphi (which stands for development of libraries of physical models for an integrated design environment) is a three-year project awarded under the micro-electronics domain of the esprit iii work programme. the project commenced on november 1, 1993, and is due for completion in november 1996. it involves 278 man-months of work. the cost is 4 million ecu (approximately $5m), 50% funded by the european union. the project consortium partners consists of a mix of industrial companies manufacturing a range of electronic equipment, a software supplier and a university-linked research institute, namely: alcatel bell (belgium); alcatel espace (france); philips cft (netherlands); thomson csf (france); flomerics (uk); and nmrc (ireland). the project coordinator is flomerics.

 

the parts studied fall into the following categories: plastic mono-chip packages (pqfp, plcc, ppqfp, pbga, pdip, tsop, ssop, tssop); ceramic mono-chip packages (cpga, cdip, cerquad, lccc, cqfp, cbga); specific parts (mcm, chip-on-board, t0220, t03); passive parts (electrolytic capacitor, transformer); air flow parts (perforated plates, axial and radial fans); heat transfer enhancers (various heat sink styles); interfacing materials (pastes, die attach). the creation of thermal models of these parts, correct for the intended range of thermal environments they are likely to encounter in applications, is a non-trivial exercise: the possession of thermal cad software is only a small part of what is needed.

 

in delphi, the best methodologies for model building are being established. for all parts considered, two kinds of thermal model are constructed: a detailed (or full) model and a compact model. for example, for a mono-chip package the detailed model consists of a detailed conduction model containing several thousand computational nodes, whereas its compact model equivalent is a thermal resistor network containing no more than 10 (say) nodes.

 

delphi will achieve its full potential when the suppliers of the parts, ie. the component manufacturers, supply with their hardware thermal models of their parts in some generic format. a portion of project funds are allocated for developing links with component manufacturers and international standardization bodies: for example delphi plays an active role in the deliberations of the jedec committee jc15.1. an outcome of delphi is a methodology for adoption by component manufacturers, which will enable them to produce validated thermal models for passing on to their customers.

 

here delphi defines a boundary to separate the 'thermal responsibilities' of the component manufacturer from those of their customers: the component manufacturer is responsible for the thermal model of the part and nothing else; and the end user is responsible for the specification of the thermal environment to which the part is exposed (ie. the convective, conductive and radiative heat transfer from the surface of the part and through its leads).

 

for the component manufacturer, delphi provides: a methodology for generation of compact models (from the detailed models) valid for a very wide set of thermal environments; and two novel experimental procedures (the double cold plate method and the submerged double jet impingement method) used to validate the detailed models. for the equipment manufacturer, delphi provides (within flotherm) validated generic models of a range of electronic parts (eg. chip packages, fans, heat sinks, etc) in either a detailed or compact model format.

 

for further information consult:

 

"delphi - a status report on the european union funded project for the creation and validation of thermal models of electronic parts", h i rosten, thermal management of electronic systems, proc. of eurotherm seminar 29, 20-22 sept. 1995, leuven, belgium.

 

h. i. rosten
technical director
flomerics limited,

surrey, u.k.

 

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