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metal foams have found increasing use in thermal management. their surface area is much larger than regular finned heat sinks, making the available surface area for heat transfer attractive.
on the other hand, their increased pressure drop and interfacial resistance makes them vulnerable to not being useful for some applications. in this article, the goal is to gain an understanding of porosity and permeability of metal foams and their role in electronics cooling.
click here for the full article.
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