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jet impingement is one of the most efficient solutions for cooling hot electronic devices, as it can create a very high heat transfer rate on an impacting surface. direct cooling of high-power chips, by using jet impingement via dielectric liquids, shows great potential even though its implementations are more complicated than traditional air and liquid impingement cooling methods.
unlike the conventional air and liquid impingement cooling which rely on heat sinks or cold plates, using dielectric liquids in intimate contact with silicon devices eliminates, deleterious effects of solid–solid interface resistances and thermal impedance created by thermal interfere materials.
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