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June 2013
library  >  Qpedia - Monthly Thermal eMagazine

Ultra Thin Flat Heat Pipes for Thermal Management of Electronics


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the decrease in size of the new generation of portable electronic devices imposes a severe constraint on their incorporated thermal management devices. thinner and more compact laptops, for instance, require ultra thin form factor cooling devices.

 

for example, newly developed mobile processors in bga packages must be thin enough for use in notebooks only 18 mm thick. traditionally, flat heat pipes have been used for this type of application. 

 

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