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with the increase in the power dissipation of components and the parallel reduction of their size, engineers and researchers across the globe have been predicting that the era of air cooling might come to an end. even though in some applications, with very high power dissipations such as igbts, air cooling may not be adequate and liquid cooling is a must; air cooling will continue to be the first choice for most electronic cooling applications for many years to come.
advances in air cooling continue to extend its use and the implementation of thermoelectric coolers (tecs) in heat sink applications is one such effort.
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