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passive, two phase liquid cooling schemes for thermal management of electronics rely on heat pipes and thermosyphons. thermosyphons are passive cooling devices able to overcome the capillary limitation of heat pipes by using gravitationally induced buoyancy to drive the flow. there are several configurations in which thermosyphons can be deployed.  

this article reviews an analytical approach for finding the theoretical cooling limit for a thermosyphon with a flow boiling arrangement. a pressure model was developed and used to predict the critical heat flux (chf) of such a device. 

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