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spreading resistance continues to play a dominant role in the overall heat transfer from the source to sink.  with trends towards smaller component footprint and higher power dissipation in electronic components, the need to spread the heat over the base of the heat sink has become very important to reduce the spreading resistance.

in some applications such as high power lasers, there might be a need to have a fairly uniform temperature distribution. in such situations a vapor chamber can be one arsenal in the design tools to tackle these problems. 

this article will help engineers get an overview of vapor chambers and their use in electronics cooling. 

click here to read the entire pdf article, there is no cost for this technology paper.