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February 2015
library  >  Qpedia - Monthly Thermal eMagazine

New Design Concepts in 3D Stacked Chips and Their Thermal Challenges


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in today’s mobile handset market the trend is to provide high performance, low cost components with integration of functionality and small form factor. the ever increasing demand of handset makers to provide smaller, thinner and lower cost packaging solution drives the packaging industry to develop packages that integrates more devices in the same footprint in which devices are integrated within the package in vertical direction, named 3d packaging.

 

in this, the logic device and memory devices are packaged and tested together and then stacked together in a package form typically known as package on packages (pop) technology which is popular and widely used in mobile phone industry.

 

while a boon to smaller and thinner handsets, and the consumers who use them, thermal engineers have new challenges to address.

 

click here to read the entire pdf article, there is no cost for this engineering paper.

 

 

Choose category and click GO to search for thermal solutions

 
 

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