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Archived Magazines » August 2005

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Flopack Version 5 Supports New JEDEC Thermal Testing Standard

Flopack Version 5 Supports New JEDEC Thermal Testing Standard Flomerics has just introduced Version 5 of its web-based Flopack software providing the ability to create Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1*. details>>
 

PCB thermal design as easy as 1,2, done

PCB thermal design as easy as 1,2, done Watch CoolitPCB in action details>>
 

Stokes Research Institute Releases Guide to Evaluating Thermal Analysis Software

Stokes Research Institute Releases Guide to Evaluating Thermal Analysis Software The Stokes Research Institute (SRI) at the University of Limerick, Limerick, Ireland, has released a guide to evaluating thermal analysis software that can be downloaded at www.stokes.ie/pdf/questionnaire.pdf. details>>
 

Exhibitors at Summit 2005

Exhibitors at Summit 2005 In addition to a series of comprehensive lectures by industry experts and short presentations by CoolingZone suppliers, the exhibition area will be open during the summit so that you can interact with solution providers in a relaxed atmosphere details>>
 

5th International Business & Technology Summit

5th International Business & Technology Summit This year's summit will feature in-depth and hour-long lectures by experts in various aspects of electronics cooling details>>
 

Moving to Liquid Cooling: Common Sense Design Considerations

Moving to Liquid Cooling: Common Sense Design Considerations A FREE workshop offered by Lytron at CoolingZone's Business & Technology Summit in August 2005 details>>
 

Innovative Research Offers FREE Workshop at the Summit 2005

Innovative Research Offers FREE Workshop at the Summit 2005 Innovative Research will present Macroflow, an easy-to-use and computationally eficient software based on the Flow Network Modeling (FNM) approach for rapid system-level thermal design. details>>
 

Narrow gap cooling

Narrow gap cooling Air cooling is sometimes described as a function of three parameters, velocity, temperature difference and surface area. This is somewhat incomplete. There is yet another important parameter, the hydraulic diameter. details>>
 

New players in Cooling Supply chain

New players in Cooling Supply chain As the power dissipation increases and more people implement liquid cooling (single and two-phase) or refregiration, a new set of components will be required. In the ear dominated by air cooling the major players were details>>
 

A Short Course at the Summit 2005: Design of Liquid Cooling Systems

A Short Course at the Summit 2005: Design of Liquid Cooling Systems This short course presents a birds-eye view of liquid cooling technology. While liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades. details>>
 

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