Archived Magazines » July 2006
Disaster Recovery Site Improves Thermal Security

Reducing Contact Thermal Resistance
Reducing Contact Thermal Resistance The trend in the electronics packaging industry is towards smaller, more powerful devices. With these small, high power components, however, there are also higher heat fluxes. As a result, engineers must find ways to minimize the thermal resistance from the electronic device junction to the ambient air. This thermal resistance can be expressed as Rja, where: Rja = Rjc + Rcs + Rsa. One way to...
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Portable Anemometer Simplifies Temperature and Air Velocity Measurement

APC Uses Airflow Simulation to Solve Data Center Cooling Problem

Tony Kordyban to Deliver a One-day Short Course on August 2006

Controller Characterizes Cold Plate and Heat Sink Cooling Performance

Lytron Relaunches its Engineers Units Converter & Equation Solver

Coolit v6.0 Executes Major Changes

Computer Simulation Helps Ensure Comfort Inside Exhibition Pavilion

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