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Archived Magazines » October 2006

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Recirculating Chiller Protection Options

Recirculating Chiller Protection Options Recirculating chillers are "off-the-shelf" liquid cooling systems that offer precise temperature control and/or cooling below ambient temperatures. Chillers have a number of options to configure the system to your particular application. These options include protection options, convenience options, special applications options, and fluid compatibility options. rnrn details>>
 

Calculating Liquid Loop Resistance

Calculating Liquid Loop Resistance This article provides a simple equation for calculating the total termal resistance in a closed liquid loop used for cooling a heated device. details>>
 

Lytron Opens New Factory & Corporate Offices in Woburn, MA

Lytron Opens New Factory & Corporate Offices in Woburn, MA Lytron recently announced the completion and opening of its new factory and corporate office space in Woburn, Massachusetts. With this new space north of Boston, Lytron has doubled its square footage and increased its manufacturing capabilities, positioning itself for continued growth. details>>
 

Thermal + EMC Simulation Helps Get IT Infrastructure Products to Market 3-6 Months Faster

Thermal + EMC Simulation Helps Get IT Infrastructure Products to Market 3-6 Months Faster Suppliers of IT infrastructure equipment are designing newer products to meet more stringent Class B electromagnetic compatibility (EMC) requirements. Some companies have been addressing EMC during the early design phase using FLO/EMC electromagnetic simulation software from Flomerics. details>>
 

Thermal Engineer Needed

Thermal Engineer Needed Degree Controls, Inc. seeks a self-motivated individual with demonstrated capabilities and experience in thermal design and analysis and thermal packaging of electronic devices. This individual will be responsible for the thermal design and analysis of components; providing details>>
 

Heat Sinks Cool BGAs in Low Air Flow Conditions

Heat Sinks Cool BGAs in Low Air Flow Conditions Advanced Thermal Solutions, Inc. (ATS) has introduced a low profile, high performance heat sink designed for cooling hot BGA components in low airflow velocity conditions. The EX2 heat sink is only 9 mm in height, which allows its use inside enclosures where space is limited. Its case-to-ambient thermal resistance is 1.8°C/W within an air velocity of 600 ft/min. details>>
 

Heat Sink Cools Low-Power 25mm x25mm Processors

Heat Sink Cools Low-Power 25mm x25mm Processors NORWOOD, Mass, September 5, 2006 – Advanced Thermal Solutions, Inc. (ATS), introduced the new ATS-EX84 “Pelican” Heat Sink for cooling 25 x 25 mm PCB components, such as lower power flip chips with heat flux characteristics. The EX84 is specifically designed for cooling devices running below 10W. details>>
 

NEW ACTIVE AND PASSIVE HEAT SINKS FROM ATS COOL FREESCALE DUAL-CORE PROCESSORS

NEW ACTIVE AND PASSIVE HEAT SINKS FROM ATS COOL FREESCALE DUAL-CORE PROCESSORS Advanced Thermal Solutions, Inc. (ATS), a leading engineering and manufacturing company focused on the thermal management of electronics, today announced it is introducing two new heat sink solutions for cooling Freescale Semiconductor’s MPC8641D Dual-Core PowerPC® Processors, after more than a year of design and testing. ATS is demonstrating the two new cooling solutions as well as, it... details>>
 

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