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Archived Magazines » December 2006

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A Primer on Pressure Drop

A Primer on Pressure Drop All of Lytron's thermal systems are designed for maximum performance at a specific flow rate. Less flow will cause the system to under perform. Flow rate is dependent upon the system's pressure drop and the pump's head pressure. This article reviews how to determine your pressure drop and how to select a pump for your system. It also provides tips on how to minimize pressure drop. details>>
 

DegreeC ATM2400 Airflow Management System

DegreeC ATM2400 Airflow Management System The rush is on for end of the year capital equipment. A 12 Channel system can run as low as $8,500 and Degree Controls, Inc. is currently offering a free laptop with the purchase of a larger system. details>>
 

Custom Liquid-to-Liquid Cooling System Spotlight

Custom Liquid-to-Liquid Cooling System Spotlight A large US-based manufacturer needed a rack mount liquid-to-liquid cooling system (LCS) that could maintain a process water temperature of 25°C (± 5°C) on a critical section of its manufacturing line. Lytron’s engineers met the manufacturer's needs by starting with a standard ambient cooling system rack mount design and adding LCS components... details>>
 

Gore Introduces New Silicone-Free Thermal Interface Material

Gore Introduces New Silicone-Free Thermal Interface Material Elkton, Md. (November 2006) W. L. Gore & Associates (Gore) is pleased to introduce a new capability to the GORE™ POLARCHIP® Thermal Interface Material family. GORE™ POLARCHIP® SF3000 Silicone-Free Thermal Interface Material is a truly soft silicone-free thermal gap pad. The absence of silicone eliminates the problems of silicone outgassing and silicone details>>
 

ANCIS Optimizes Data Center Cooling with Flovent CFD Software

ANCIS Optimizes Data Center Cooling with Flovent CFD Software ANCIS Incorporated, a San Francisco based consultancy, recently helped a major telecom firm develop a greatly improved HVAC design standard for its central offices (COs) using Flomerics’ Flovent computational fluid dynamics (CFD) software to predict air intake temperatures for sensitive electronic equipment. details>>
 

Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design

Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design Cisco Systems has defined a new concurrent electronic/thermal engineering approach that has reduced the time required to identify and solve thermal problems, making it practical to address thermal issues at an earlier stage in the design process. details>>
 

Shrinking Rectifier Size

Shrinking Rectifier Size Eaton, a leading global provider of comprehensive power quality and backup power management solutions, faced stiff design restrictions in producing a new rectifier module. The 3 kW unit was going to dissipate 300 W, and in order to achieve balanced three-phase currents, the units had to be mounted in multiples of three per 19-inch wide shelf. details>>
 

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