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Archived Magazines » May 2011

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10th International Business & Technology Summit

10th International Business & Technology Summit The 10th International Business & Technology Summit sponsored jointly by CoolingZone and ElectronicsCooling magazine will be held on August 18-19 in Natick, MA. The summit will be followed by a one day course on August 20 titled "Cooling Electronics without All that Hot Air" delivered by Tony Kordyban in his usual engaging and informative way. details>>
 

Challenges and Pitfalls of Temperature Measurement

Challenges and Pitfalls of Temperature Measurement Dr. Rober Moffat will be giving a very informative lecture at CoolingZone's Business & Technology Summit on August 18-19, 2010. He will focus on the problems that may arise during temperature measurement and provides practical advice on the methods to avoid them. details>>
 

Thermal Engineering Challenges at the Device and Microprocessor Levels

Thermal Engineering Challenges at the Device and Microprocessor Levels The power distribution non-uniformities across chips results in sharp temperature gradients and multiple temperature peaks across a microprocessor or chip, which can adversely impact reliability and performance. Therefore, microprocessor packaging and cooling solutions should not only consider the worst case senario but details>>
 

Challenges of Liquid Cooling

Challenges of Liquid Cooling Many have a conscious, or perhaps sub-conscious, fear of the two together. In this lecture, the plain facts of the topic of liquid cooling for electronics will be laid out so that attendees can make logical informed decisions about liquid cooling and whether their applications would benefit from using it. General background knowledge of what is included in a liquid cooling system and what is... details>>
 

Challenges and Innovations in Avionics and Military Electronics Thermal Management

Challenges and Innovations in Avionics and Military Electronics Thermal Management Avionic and defense electronic systems are continuing to add functionality and features resulting in thermal design engineers being tasked to devise efficient thermal management approaches with minimum weight, volume, and cost. While adding the latest high performance devices often increases dissipated heat loads, details>>
 

Summit 2010 - Keynote Lecture

Summit 2010 - Keynote Lecture From health care to education to security, almost every aspect of life has benefited from the Silicon Revolution. Integrated circuits serve as the “brains” of nearly all engineered entities that require rapid acquisition, transfer, and interpretation of information. The continued evolution of electronics for the 21st Century, however, requires a fundamental shift in perspective, coupled with... details>>
 

Thermal management of RF and Microwave devices

Thermal management of RF and Microwave devices Radio Frequency devices are used in communications and radar systems. As the power density of these devices increase, removal of associated large heat fluxes beckons novel thermal management solutions. The starting point in thermal management of RF devices is the transistor design, where modifications to the transistor geometry can have a substantial influence on the maximum junction temperature... details>>
 

TileFlow 4.2 Now Available

TileFlow 4.2 Now Available TileFlow now allows you to include upflow CRAC units in the data center layouts. For these units, the dimensions, the details of the return and supply openings, the flow rate, and the cooling characteristics are specified through upflow CRAC unit styles. The supply openings are always located on the top face, but the return openings can be on any of the five remaining faces. details>>
 

Challenges of Thermal Management and Design of compact 3-D Microsystems

Challenges of Thermal Management and Design of compact 3-D Microsystems The talk provides an overall review of thermal design performance limitations and thermal management techniques covering 3-D Microsystems with focus on mobile and handheld products. Thermal challenges are discussed including a key thermal design parameter concerning outer skin temperature limits based on natural convection and radiation with the ambient. Passive conduction techniques to increase... details>>
 

Cooling Challenges of 3D Packaging

Cooling Challenges of 3D Packaging The convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into the same package is becoming more crucial. Over the past few years, die stacking has emerged as a powerful tool for satisfying these challenging... details>>
 

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