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Press Releases

  • ATS offers Portable Anemometer for measuring airflow velocity

    The ATS-0345-1 from Advanced Thermal Solutions, Inc. (ATS) is a portable vane anemometer for measuring air flow speed and volumetric flow rate. details>>
  • Future Facilities launches neutral file format for thermal simulation models

    Future Facilities, provider of leading thermal simulation tool, 6SigmaET, has announced the availability of a new neutral file format that will help solve the challenge of sharing design models between different thermal simulation toolsets. details>>
  • TT Electronics introduces lightest, most effective PCB mounted heatsink for power resistors

    TT Electronics, a global provider of engineered electronics for performance critical applications, has announced the WMHP-HS heat sink specifically designed to optimize the thermal performance of its WMHP series power resistors. details>>
  • Cavium Expands Industry Partnerships to Drive OCP NIC 3.0

    Cavium, Inc. announced that it is collaborating with Hewlett Packard Enterprise (HPE), to bring hyperscale-inspired designs based on Open Compute Project into mainstream enterprise IT. details>>
  • Microsemi Announces Adaptec Smart Storage Compatibility with AMD EPYC Processor

    Microsemi Corporation announced interoperability between its 12 gigabits per second (Gbps) SAS/SATA host bus adapters (HBAs) and redundant array of independent disk (RAID) adapters. details>>
  • Larson Electronics LLC Releases 100W Portable Explosion Proof LED

    Industrial lighting leader, Larson Electronics LLC, announced the release of a 100-watt explosion proof LED lamp, mounted on a portable non-sparking triangle aluminum base. details>>
  • ERS Electronic Announces AirCool PRIME Thermal Chuck Tech Will Soon Be Available

    ERS Electronic, the leader in the market of thermal test solutions for semiconductor, is announcing that its AirCool PRIME thermal chucks will soon be available in 200mm format. details>>
  • NEO Tech Releases New LTCC and AlN Design Guidelines

    NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-Fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions. details>>
  • Qorvo Introduces Most Powerful GaN-on-SiC Transistor

    Qorvo, a leading provider of innovative RF solutions that connect the world, introduced the highest power gallium nitride on silicon carbide (GaN-on-SiC) RF transistor. details>>
  • Axcelis Announces New Purion H Order from Leading Advanced Logic Chip Maker

    Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced that it has penetrated a new customer with the Purion H high current system with an order from a leading advanced logic chip manufacturer. details>>
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