Press Releases

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  Laird Technologies Releases Two New Tflex Series Products to their Thermal Gap Filler Line

  The Tflex� SF800 and Tflex� SF200 are the latest addition to Laird Technologies' thermal gap filler line. The introduction of these two new products expands Laird Technologies' silicone-free gap pad selection. Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features extremely low contact resistance for effective heat transfer. These products... details>>
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  JARO's New 80mm x 76mm Air Mover Spins at over 19,000 rpm to create industry leading fan flow

  JARO's New 80mm x 76mm Air Mover Spins at over 19,000 rpm to create industry leading fan flow. details>>
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  New Thermal Interface Materials from APNT Meet Power Semiconductors Requirements

  Applied Nanotech Holdings releases their THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging. The thermal interface composites boast a "significantly higher level of heat dissipation performance" to meet the requirements of the power sector, details>>
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  Alpha Novatech Announces LPD / MD / UB Series Additional low profile heat sinks

  Alpha Novatech has expanded its wide range of off-the-shelf products to meet with increasing customer's requirements. The expansion includes their 6mm, 7mm, 8mm and 9 mm high series of low profile heat sinks details>>
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  ATS Releases Heat Sink Selection Tool to Cross Reference Semi Conductors to Heat Sinks [sponsored]

  ATS has released a new on-line tool to allow engineers and others to cross reference specific semiconductors with a suggested thermal management solution. The ATS Heat Sink Selection tool gives engineers a web based tool to match AMD, Altera, ADI, TI, Xylinx and more with suggested solutions to keep those chips cool. details>>
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  Laird Acquires Nextreme Thermal Solutions Technology

  Laird PLC ("Laird") today announces the acquisition of Nextreme Thermal Solutions, Inc. ("Nextreme"), the US based developer of thin-film thermoelectric technologies. details>>
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  Semi-Therm Program Announced with Executive Briefing on the Thermal Management Market [sponsored]

  Semi-Therm 29 has announced their full program with topics covering thermal management of data centers, servers, LED and more. Materials science plays a significant role this year as well. Semi-Therm has also announced a special session, "Executive Briefing: Thermal Management Market Visions & Strategies". details>>
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  CD-Adpaco Announces Webinar: Best Practices for Forced Convection Simulations, Part 2 [sponsored]

  CD-Adapco to hold a webinar, "Best Practices for Forced Convection Simulations, Part 2" on February 21, 2013. The on-line learning event will be held in multiple timeszones. Topics covered include: somulations settings, including solver choices; Convergence criteria; Viewing important results (in unique ways); Sanity checks including expected variations. Specific examples will be... details>>
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  Aseteks ISAC Data Center Liquid Cooling Technology Selected by U.S. DoD

  Asetek today announced that its ISAC (Inside Server Air Conditioning) has been selected by the DoD (Department of Defense) to participate in its TROPEC (Transformative Reductions in Operational Energy Consumption) program. TROPEC is a collaborative Department of Defense (DoD) and Department of Energy (DOE) program that targets game-changing enhanced energy efficiency for critical applications at... details>>
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  Aavid Thermalloy Has Released A Complete Line of Liquid Cooled Systems

  Aavid, a leading company that designs and manufactures both Liquid Cold Plates (LCP) and Liquid Cooling Systems (LCS) has integrated their product lines together creating a chip to system family of liquid cooling technologies. details>>