Press Releases

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  Cambridge Nanotherm launches a new design of metal-backed PCB made from a ceramic dielectric

  Cambridge Nanotherm is launching a new design of metal-backed PCB made from a ceramic dielectric which is claimed to significantly reduce LED die temperatures in luminaire designs. details>>
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  TECA introduces a benchtop Liquid-Cooled Cascaded Cold Plate System for ultra-low temperature cooling

  TECA Corporation (Chicago, IL), introduces a benchtop Liquid-Cooled Cascaded Cold Plate System for ultra-low temperature cooling. The LHP-1200CAS provides direct contact cooling down to -70C. Designed for laboratory use, the LHP-1200CAS offers versatility and precise control. It can be used to cool components, materials, chemicals, and samples in applications within embedded technology, test and... details>>
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  ASUS Releases Limited Edition ROG ARES II with New Hybrid Thermal Design

  Asus has released a custom cooler that utilizes liquid and air cooling to achieve drastically improved heat dissipation. The hybrid design consists of a 120mm fan block that easily fits in PC cases. The fan cools a closed-cycle liquid system with a tube running to the graphics card to provide dedicated heat removal from the dual GPUs. The new thermal management solutions release was custom... details>>
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  Laird Technologies Expands EMI Metals Product Line with SMD Grounding Contacts

  Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird's value proposition to deliver solutions for today's smaller, more advanced electronics. As... details>>
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  Lord Corporation To Showcase Thermally Conductive Silicone Encapsulants At Strategies In Light

  LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - will showcase three thermally conductive silicone encapsulants at the upcoming Strategies in Light show. details>>
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  Mercury Computer Systems Announces Cold Plate Technology for Embedded and OpenVPX Technologies

  Innovations include integrated thermal solutions for existing air-cooled and conduction-cooled standards, plus a new Air Flow-By� solution that offers unprecedented levels of OpenVPX�-slot cooling details>>
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  Thermacore DARPA MACE Contract with U.S. Department of Defense Leads to Breakthrough Thermal Technology

  Thermacore, Inc. a leading provider of advanced thermal solutions, is offering a new generation of compact, custom-built, high-performance air-cooled heat sinks, the result of a multimillion-dollar development contract from the Defense Advanced Research Projects Agency (DARPA), which ended on September 30, 2012. details>>
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  New MicroCool website unveils new standard cold plate products

  Wolverine's MicroCool� Division has launched its redesigned MicroCooling.com website and unveiled its new Online Store featuring commercially available MicroCool� Standard Cold Plates for the IGBT Power Electronic and CPU markets. details>>
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  TDI is Granted Patent for Low Voltage Converter Utilizing Distributed Secondary Circuits

  TDI Power has been granted a patent for a low output voltage converter utilizing distributed secondary circuits. The inventors of this unit include Gary Mulcahy, CTO, John Santini, VP of Engineering and Joe Mancuso, Principal Engineer. details>>
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  GE Cooling Technology, As Thin As A Credit Card, Enables Ultra-thin Tablets, Laptops

  Adapted from technology that GE researchers originally developed for commercial jet engines, GE (NYSE: GE) has announced a major technology breakthrough, called DCJ, which adapts this technology for the cooling of consumer electronics. DCJ will support the next generation of thinner, quieter and more powerful tablets, laptops and other electronic devices. details>>