Press Releases

• Electronic Interconnect Now Offers PowerLink PLPCB

  Electronic Interconnect (EI), a leading provider of PCBs and PCB engineering and design services, announces the availability of Powerlink PLPCB constructions for electronic assemblies where thermal management/heat dissipation capabilities are desire details>>

• New Cooling Fan Series from NMB Offer High Efficiency and High Performance

  NMB Technologies Corporation, a Minebea Group Company, has released a new generation of high power, high efficiency series of cooling fans and impellers for demanding applications such as storage and server rack systems, routers and switches, base stations, modular data systems, as well as medical and industrial applications. details>>

• Highly Advanced Building and Data Center Cooling System Granted Issuance of U.S. Patent Notice After Only Seven Months

  INERTECH, LLC, and Skanska's Mission Critical Center of Excellence announced today that their eOPTI-TRAX(TM) system, the most highly advanced and energy efficient building cooling platform available on the market today, has received U.S. patent notice seven months after filing with the United States Patent and Trademark Office (USPTO). details>>
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  Bergquist's Liqui-Form� 2000 Thermal Interface Material Has All Your Assembly Angles Covered

  New one-part Liqui-Form 2000 is a high thermal conductivity liquid formable thermal interface material designed for demanding applications. details>>

• Exclusive heat exchanger mode a key feature of the new TECA Corporation's mew thermoelectric air conditioners

  TECA Corporation (Chicago, IL), creator of the original thermoelectric enclosure cooler, announces two new thermoelectric air conditioner models with a heat exchanger mode which is exclusive to TECA. The AHP-2250 and the AHP-3250 are the largest air conditioners TECA manufactures, to date. The AHP-2250 offers 2060 BTU/hr (605 watts) cooling capacity. The AHP-3250 offers 2600 BTU/hr (765 watts)... details>>

• Visteon Now Offers Three Levels of Battery Thermal Management

  The prevailing technology to meet the power demand of electrified vehicle is the lithium-ion (li-ion) battery. Li-ion technology is more temperature sensitive than previous nickel metal hydride (NiMH) batteries, requiring �human-like� temperature conditions. Extreme temperatures can temporarily reduce the amount of power available, limit drive range and potentially permanently degrade battery... details>>

• EPAC's New Software Predicts Cold Plate Performance

  EPAC's new COLDPLATE V7.0 software makes design and analysis of cold plates for electronic cooling easier and faster then ever before. COLDPLATE from EPAC has been updated to include serpentine, parallel or custom layout tube flow. details>>

• EIC Solutions Releases New Pre-Packaged Air Conditioned Enclosures Protect and Cool Electronics, Telecom Equipment, Cameras, DVRs, more

  EIC Solutions, Inc., a leading manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has introduced a new series of air conditioned electronic/electrical enclosures. The new Pre-packaged Protector Series enclosures feature rugged metal construction and a built-in thermoelectric air conditioner. The thermoelectric cooling unit does not use a compressor,... details>>

• Third Millenium Engineering Releases a Thin Cavity Fluidic Heat Exchanger; Evaluation Kits Available

  Third Millenium Engineering has released its Thin Cavity Fluidic Heat Exchanger, or TCFHE. The TCFHE is a simply constructed, small volume, high performance effective method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates from a very high velocity air flow, a very thin boundary layer, and high air utilization. An... details>>

• Optical Internetworking Forum (OIF) Addresses Thermal Management at the Faceplate with New Whitepaper

  The Optical Internetworking Forum (OIF) approved two new Implementation Agreements (IAs), published two new whitepapers and completed interoperability testing in the last month addressing a wide variety of technologies. The whitepaper on Thermal Management at the Faceplate represents the work of the OIF to consider the system issues for thermal management at the faceplate of a line card. details>>