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coolingZONE-15 Thermal Management Summit (Entire Program)

Speakers

 

Comparison of HPC Telecom Data Center Cooling Methods by Operating and Capital Expense .
by Dr. Alexander Yatskov Ph.D, PE, Speaker

In the near future, in order for data centers continue increasing in power density, alternative cooling methods, namely liquid cooling, must be implemented at the data center level in place of standard air cooling. Although microprocessor-level liquid cooling has seen recent innovation, cooling at the blade, cabinet, and data-center level has emerged as a critical technical, economic, and environmental issue. In this talk, three cooling solutions are assessed to provide cooling to a hypothetical, near-future computing cluster. read more

Predictive Analytics for Data Center Thermal Risk and Reliability Management .
by Dr. Cliff Federspiel, Ph.D., Speaker

This presentation will describe a means of precisely determining the functional cooling redundancy of a facility, show statistical analysis that correlates poor redundancy with high temperature events, and share tools that identify and suggest remediation for rooms and facilities at risk. Use of cooling analytics is an important aspect of operational excellence, and is a competitive differentiator for datacenter operators. read more

Recent Developments in Passive 2-Phase Immersion Cooling of Computer .
by Phil Tuma, Speaker

Passive 2-phase immersion cooling (P2PIC) is being explored by 3M and partners as a means of meeting the energy efficiency and power density needs of the computing industry. This presentation will review the comparative merits and operating principles of 2PI. Its application for Bitcoin mining gives a glimpse of what may be possible when x86 hardware evolves to take advantage of the technology\'s capabilities. Recent cluster-scale deployments with supercomputer hardware have provided valuable insights for future deployments. read more

Heat Pipe Selection, Bending and Application Strategies .
by Dr. Rahul Mulinti, Ph.D., Speaker

Heat pipes are heat transferring devices that rely on phase change phenomenon to efficiently manage heat transfer between a heat source and a heat sink. Their high effective thermal conductivity makes them ideal for applications where heat needs to be moved across a certain distance with least thermal resistance. Heat pipes offer flexibility in terms of functionality across a wide range of heat loads as well as operating temperatures. They can be bent and manipulated to get around geometric constraints that usually restrict the use of traditional heat transferring mechanisms. Designing an optimum heat pipe will depend on several parameters that include but not limited to the heat load, operating temperature, orientation and geometry. This paper will outline some of the strategies that can be used to select the right heat pipe for a specific application. read more

Flexible Thermal Ground Planes for Smartphones and Wearable Electronics .
by Dr. Y.C. Lee, Ph.D., Speaker

A well-known challenge for mobile systems, e.g. smartphones, tablets and wearable electronics, is the control of their skin temperatures, i.e. the temperatures of the case exterior surface touched by fingers, ears or other part of a human body. It is essential to keep the skin temperatures lower than 45-50oC for smartphones and 38oC for wearable electronics. Vapor chamber, copper and graphite are recognized as three major thermal management technologies for the skin temperature control. Vapor chamber is known for the best thermal performance; however, it is typically bulky and expensive. A new flexible thermal ground plane (TGP) has been developed to eliminate such thickness and cost barriers. This talk will discuss this development and it\'s application. read more

Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling .
by Vineet Barot, Short Course Presenter

Thermosyphons and heat pipes are used to transport large amounts of heat over a particular distance by using a two-phase fluid inside a hollow pipe. The more widely used heat pipe uses a wicking structure to transport the liquid back to the hot end whereas a thermosyphon is a simple hollow tube that uses gravity. The lack of a wicking structgure make the thermosyphon much less expensive than the traditional heat pipe. However, because of the integral role that gravity plays in the operation of the thermosyphon, it is only effective when the evaporator is below the condenser. In this 2 hour short course, we will focus only on the non-looped single tube, how to properly size, choose, and deply for electronics cooling. Various correlations and equations will be used to provide an analytical \"toolbox\" to attendees. read more

Liquid Cooling Types for Data Center Computing: Choosing and Deploying .
by Phil Hughes, Speaker

Currently the data center has been considered separate from the IT equipment that is contained within it. While the sole use of air as the heat transfer medium enabled this approach, there are several disadvantages. All of which have a negative effect on the bottom line - increased profitability. Liquid cooling can deliver lower costs and higher profitability but requires that users take a much more holistic view of the Data Center and IT equipment it contains. This presentation will present some of the forms of liquid cooling and explains how their applicatton would effect both the Data Center and the IT equipment. read more

Analytical Modeling in Thermal Management Design .
by Dr. Kaveh Azar, Ph.D., Short Course Presenter

Modeling and simulations are the cornerstone of any successful product launch of electronics products. Engineers are faced with three modeling options, Analytical, Computational and Experimental. In this short course, these modeling options are reviewed and their application to a problem domain is discussed. Emphasis is on the use of analytical modeling and how it can help with faster decisions earlier in the design cycle. read more

How to Perform and Understand Temperature Measurement Within Electronic Systems .
by Dr. Kaveh Azar, Ph.D., Speaker

Attendees will become familiar with the importance of temperature measurement in electronic systems, the instruments that are necessary and the location within a systems where testing should be conducted. Further, salient features of each measurement system and technique will be highlighted, and the most ideal sensors and their placement for accurate temperature measurement will be presented. read more

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