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coolingZONE Technical Newsletter March 31, 2015
Top Stories
Reducing The Cost of Data Center Cooling With a Hybrid Approach
Data centers are the backbone of our information economy but expensive to power and cool, this hyrbid method reduces the cost to cool them
CZ Design Corner, Calculate Heat Transfer From a Plate Inside a Duct
When another board is so close it could produce channel-like behavior, use this method to calculate the heat transfer
GE's Magnetic Refrigeration Not Just a Lab Experiment
Magnetic cooling may not be new, but GE appears to be first to make it viable.
Ten stupid things engineers do to mess up their cooling
These 10 cautions will help thermal engineers design better thermal management solutions
coolingZONE News
coolingZONE-15 Thermal Management Summit, October 20-22
October 20-22, 2015 we'll be holding the 15th annual coolingZONE Thermal Management Summit, a Live Webcast!
coolingZONE Bookstore
Need a quick class in heat pipes? How about a book on thermal fundamentals? Check our bookstore for videos, books and more!
Solaria Thermal
Solaria Thermal Software. Problems are simulated geometrically using 2D Plate and 3D Brick and Tetrahedron elements. Solaria can accurately represent...
Product & Industry News
Sensirion Introduces The SLS-1500 Compact Liquid Flow Meter
Delivering measurements for 0-40 ml/min flow rates, SLS-1500 has 20 msec typ response time and can monitor highly dynamic dispensing processes....
LIA Laboratories Ltd tests Show Nanotherm Thermal Management Substrates Running up to 47c Cooler than Competing Solutions
Tests by The LIA Laboratories show Cambridge Nanotherm's solution offered best-in-class thermal management solution for LEDs across comparative...
Data Translation Releases The DT9828, A Low-cost USB Thermacouple Measurement
The DT9828 design sets the accuracy benchmark for thermocouple measurements. Combined with the included QuickDAQ ready-to-measure application...
ATS offers Heat Sinks that Cool LEDs with High-density, Lighter-weight Zipper Fins[VIDEO]
Zipper fin heat sinks allow the combined use of copper and aluminum materials. In these designs, the copper base allows for optimal heat spreading...
Tate Air Flow Releases The SmartAire MZ, The Next Generation in Airflow Management
The new SmartAire MZ offers four independent control zones, a simplified user interface on the unit and on screen, and greater integration with...
Wahl Instruments Releases New Heat Spy Thermal Imaging Camera [VIDEO]
The 150 Series Heat Spy models have a 160 x 120 detector for 19,200 individually calibrated pixels with a thermal sensitivity of 0.05c to highlight...
Solvay's Release of e-Xstream Engineering's Multi-Scale Material Modeling Software Adds 13 High-Performance Solvay Resins
Solvay Specialty Polymers, a leading global supplier of high-performance thermoplastics announced today at JEC Europe that 13 of its advanced...
Fujitsu Develops 1mm Thick Loop Heat Pipe for Compact Electronics
Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased...
Fujipoly Introduces Sarcon SG-26SL Thin Bond Line Thermal Interface Material
Sarcon SG-26SL, thermal interface material delivers consistent performance across broad temperatures ranging from -55C to 205C. Packaging options...
BorgWarner Introduces Durospeed 2 Speed Fan Drive for Off High-way Truck Applications
BorgWarner's new DuroSpeed 2 speed fan drive is specifically designed to deliver reliable cooling for severe operating and vocational truck...
Technology Corner
Squeeze To Remove Heat: Elastocaloric Materials Enable More Efficient, Green Cooling []
Move over, vapor compression cooling technology. Emerging
Flip-Chip Packaging And Gallium Nitride Power Transistors [Semiconductor Today]
Researchers in Taiwan have been studying the effects of flip-chip packaging on the performance of gallium nitride (GaN) high-electron-mobility...
How a Modern Workhorse Breathes: A Look at Lenovo ThinkStation’s Tri-Channel Cooling System [Desktop Engineering]
Some heavy computer users assume — in what seem to them like sound logic — that if their workstation is showing signs of extreme heat load (loud...
Taking The Heat [Compound Semiconductor]
Could a new design of thermally integrated photonic system deliver the massive bandwidths datacommunications crave?
Refractory Metals in Thermal Management for Power Semiconductors [A to Z of Materials]
In this interview, Douglas Hardy from H.C. Starck talks about how their molybdenum and tungsten metal, composite and laminate products are used in...
Engineering How To
How to do Heat Transfer Calculautions to Size and Deploy a Thermosiphon [Video]
Learn the calculations necessary to properly size and deploy a thermosiphon. Sponsored by Qpedia Thermal eMagazine.
What is Thermal Resistance And How to Apply It To Thermal Analysis
Thermal resistance is a mathematical concept analogous to the electrical resistance we have all studied in basic physics. Here's how to calcuate and...
A Method for Approximating Component Temperatures at Altitude Conditions Based on CFD Analysis at Sea Level Conditions
Here's how to understand the performance of a system at different altitude conditions.

Conferences & Webinars
coolingZONE-15 Thermal Management Summit | A Live Webcast
SAVE THE DATE! coolingZONE Thermal Management Summit | A Live Webcast! Is being held October 19 to the 23rd, 2015. This years conference will feature both cutting edge and thermal management fundamentals topics

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