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coolingZONE Technical Newsletter October 16, 2013 October 16, 2013
Top Stories
Challenges in Testing Thermal Interface Material
How do we know that a TIM is performing as advertised? And how do we test to find out?
Application of TECs to Thermal Management of 3D ICs
3D stacked chips pose unique cooling challenges vs. 2D packaging - TEC are one solution
Heat Spreading with Copper, Silicon and Heat Pipes
CoolTech Showdown! micro heat pipes compared with pure silicon and copper heat spreaders
Heat Transfer In Metal Foam Heat Exchangers
Understanding the underlying physics behind the mesh heat sink and heat exchanger
CoolingZone Summit
coolingZONE-13 Moves to eConference With Full Registration Open Now
The Thermal Management Industry International Summit: coolingZONE-13 is changing to an eConference format on the web using live streaming. Our...
Key Note Speaker: Dr. Marc Hodes, Tufts University, Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease?
In this talk we justify the claim that by using galinstan rather than water as the coolant a thermal resistance of 0.05oC/W, i.e., 30% less than...
Full Conference Program Available
coolingZONE-13 Thermal Management eConference has a full program from liquid cooling, to TIM, to next generation approaches in air cooling. See our...
Product News
ATS Expands in the COTS Market with US Navy Sale
Advanced Thermal Solutions, Inc., (ATS), is now officially in "active" status with the United States Federal Government's System for Award...
New Stand-Alone Thermocouple Data Logger from Measurement Computing
Measurement Computing Corporation, the value leader in data acquisition, today announces the release of the USB-5104, four-channel, battery powered,...
New Polyamides For The Thermal Management Of Electronic Devices Announced By Lanxess
Electronic devices and assemblies are getting smaller and more powerful. As a result, they generate more heat during operation that has to be...
Thermal Management for LEDs and Power Electronics Grows to $4.8 Billion in 2020
Thermal management materials for light-emitting diodes (LEDs) and power electronics will be a $4.8 billion market in 2020, more than doubling from...
JMC Releases First Of Prodigy Series - The Edison Fan Micro-Controlled Thermal Innovation
JMC Products raises the bar for innovative thermal solutions with the first fan from their 'Prodigy Series'. The series constitutes a brand new...
Tubeaxial Fan Sets New Performance Standard For Electronics Cooling And Ventilation
AMETEK Rotron has introduced a tubeaxial cooling and ventilation fan with the highest performance in the industry for its package size, the company...
Lord Corporation's Encapsulant Proven To Improve Electric Motor Performance Up To 55 Percent
Technology developed by LORD Corporation, a leading supplier of thermal management, potting and encapsulation materials to the electronics, LED and...
coolingZONE-13 Moves to eConference With Full Registration Open Now
The Thermal Management Industry International Summit: coolingZONE-13 is changing to an eConference format on the web using live streaming. Our...
Double Blades, Double Cooler Performance Announced by PowerColor
The patented cooler solution, Double Blades, brings powerful performance better than ever to high end PC gaming graphics cards and other...
Fujipoly Announces New Low Resistance TIM Delivers 6.0 W/m K Performance
Fujipoly announces the introduction of Sarcon GR45A-00 a very low modulus thermal interface material with a low thermal resistance. This new...
Technology Corner
Clever design lets Fujitsu use a cooling fan in a waterproof tablet
Making a device waterproof means protecting the electronics inside against contact with liquid of any kind. However, if a device uses air cooling, it...
The science of liquid cooling
As far as I know, nobody is using liquid convection for cooling. In fact, the only place where I have seen natural water convection used is in...
True Or False? High-Power Leds Don’t Generate Ir Heat In The Forward Direction Like A Filament Lamp
If one could review the all the lighting industry’s literature of the last 10 years about high power LED lamps and luminaires, would you question...
Versarien water-cooled PCs use a “revolutionary” heatsink material
The Versarien PCs use water-cooling in conjunction with VersarienCu patented porous copper heatsinks. This technology was developed by metallurgists...
Graphene Takes The Heat
Researchers from the University of California – Riverside (UCR) discovered that a single layer of carbon atoms arranged in a honeycomb pattern,...
Engineering How To
How to Understand and Control Spreading Thermal Resistance
One of the basic concepts of electronics cooling is effective transfer of heat from semiconductor devices to the ambient using heat sinks or other...
How to Calculate Loads for Liquid Cooling Systems
This article presents basic equations for liquid cooling and provides numerical examples on how to calculate the loads in a typical liquid cooling...
How to Optimize Heat Transfer By Using the Natural Buoyancy-Induced Movement of Air
In this article we show that many applications prevent the use of forced convective flow from fans or other sources, due to acoustics, cost or other...









Conferences & Webinars
coolingZONE-13 Thermal Management eConference (On-Line | 10-21-2013)
coolingZONE-13 Thermal Management and Electronics Cooling eConference, 10/21-10/23, 24 hours a day! Lecture topics this year include: Galinstan based cooling; Approaching 0.1 degree C per watt in compact air cooled systems; Tutorial on Temperature Measurement and Analysis. Registration open!

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