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coolingZONE Tech Newsletter 8-17-17 August 17, 2017
Top Stories
Heat Sink Design Cools QSFP Transceivers
ATS engineers created an optimized heat sink design for cooling a series of QSFP optical transceivers.
Characterizing Properties of 2-D Materials
Researchers developed a simple technique for characterizing the thermal properties of crystalline molybdenum disulfide.
Studying Nanoscale Thermophoretic Forces
Researchers studied the physical mechanisms behind the movement of a gold nanocluster from a hot region to cold.
Mentor Offering Award for FloTherm Designs
Mentor is calling for entries for its first annual FloTHERM Delta TJ Award for Excellence in Electronics Thermal Design.
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Product & Industry News
ATS research-grade closed-loop wind tunnels designed for SSD characterization
The Advanced Thermal Solutions, Inc. (ATS) CLWT-115 is a research quality closed loop wind tunnel that provides a convenient, accurate system for...
Schneider Electric Licenses Patents for Hot Aisle Containment and Cooling Tech from Switch
Switch has licensed its patented hot-aisle containment and cooling technology known in the industry as the Switch T-SCIFs and the Switch TSCs to...
STEGO Filter Fan Plus Enclosure Cooling Fans from Automationdirect
AutomationDirect has added the new STEGO Filter Fan Plus series of enclosure fans to its enclosure thermal management devices lineup.
CPI Offers Key Elements for Successful Data Center Solution
Chatsworth Products (CPI), experts in protecting technology investments in data centers and telecommunications rooms across the globe, recommends a...
No Fan, No Airflow, No Problem; GE Launches Power Supply Family for Industrial Applications
GE has introduced its CC3500 family of conduction-cooled power supplies, providing the ruggedness and reliability needed in demanding industrial...
FLIR Systems Introduces Versatile Fixed Bullet Thermal Security Camera
FLIR Systems, Inc. introduced the FLIR FB-Series O fixed bullet thermal security camera designed for short to mid-range perimeter protection.
Noctua presents CPU coolers for AMD Ryzen Threadripper (X399) and Epyc platforms
Noctua presented three high-end heatsinks for the TR4 and SP3 sockets of the latest Ryzen Threadripper (X399) and Epyc platforms from AMD.
DegreeC launches high performance Airflow Switch product platform
DegreeC is proud to announce the launch of a new product line of Airflow Switches designed for a range of critical environments and flow...
First Ever Thermal Tablet Cover Keeps Tablets Safe and Operational in Freezing Environments
Gamber-Johnson announced thermal tablet covers featuring revolutionary technology that keeps a tablet warm in cross dock and freezing environments.
Newtex Acquires Thermostatic Industries, Inc
Newtex announced that it has completed its acquisition of Thermostatic Industries, Inc., a leading distributor of high temperature textiles and...
Technology Corner
Algorithm incorporates heat, flow, and form optimization to design cooling solution [coolingZONE]
A recent article on Engineering.com highlighted a new computational fluid dynamics (CFD) software program from Diabatix that makes designing liquid...
Single Molecules Act as Reproducible Transistors at Room Temperature [Engineering.com]
A team led by Latha Venkataraman, professor of applied physics and chemistry at Columbia Engineering and Xavier Roy, assistant professor of...
Meeting the Challenges of Battery Design with Modeling and Simulation [IEEE Spectrum]
The biggest challenges for battery design are energy density, power density, charging time, life, cost, and sustainability. Multiphysics simulation...
New Line of Dielectric Coolants Launched [Electronics Cooling]
Engineered Fluids announces the commercial release of its CoolFluids line of high performance dielectric cooling fluids. Designed specifically for...
TI Claims to Obsolete FPGAs for Embedded Apps [EE Times]
Texas Instruments claims to have made the field-programmable gate array obsolete for embedded industrial applications such as servo-motor control. As...
Engineering How To
How to measure chip temperatures with thermochromic liquid crystals
In this paper we describe LC thermography: a temperature measurement method that uses the color-temperature response of thermochromic liquid crystals...
How to measure thermal conductivity of composite materials
A composite material can be defined as a material in which two or more different materials are bonded together. It is sensible to make a distinction...
How to design a heat sink [Video]
In this two part lecture series, which is in an hour in total for both videos, Dr. Matthew Inman, Ph.D. provides an excellent introduction on how to...











Conferences & Webinars
INTERPACK - Packaging and Integration of Electronic and Photonic Microsystems
Aug. 29 - Sept. 1, 2017 - San Francisco, Calif. - InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division...
12th International Symposium on Numerical Analysis of Fluid Flows, Heat and Mass Transfer
25-30 September 2017, The MET Hotel, Thessaloniki, Greece - Understanding fluid dynamics and heat transfer has been one of the major advances of mathematics, physics and engineering. Our symposium covers various subjects: from new numerical methods and fundamental research until engineering applications. This annual...
IMECE - International Mechanical Engineering Congress & Exposition
Nov. 3-9, 2017 - Tampa, Fla. - ASME International Mechanical Engineering Congress and Exposition (IMECE) is the largest interdisciplinary mechanical engineering conference in the world. IMECE plays a significant role in stimulating innovation from basic discovery to translational application. It fosters new collaborations...

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