to ensure that you receive coolingzone e-news properly,
please add the following domain to your e-mail "safe" list: []
web version | send this message to a friend | subscribe
coolingzone tech newsletter 1/12/18 january 12, 2018
top stories
microchannels disperse coolant in chip stack
researchers created a cooling system that circulates coolant through microchannels and directly onto electronic chip stacks.
four-phonon challenge solved
researchers demonstrated a method for accurately modeling the interactions of four phonons in solid materials.
performance of microchannel cold plates
an article looked at the thermal performance of both macrochannel and microchannel liquid cold plates for electronics.
te material effective at room temp
researchers developed a new thermoelectric material, which has demonstrated a high power factor at room temperature.
coolingzone update
join supplier directory and promote your business
join the coolingzone supplier directory and promote your business to thousands of engineers from across the thermal management industry.
check out the new cold plate supplier directory
coolingzone introduced a new cold plate supplier directory to assist industry members looking for the latest developments in liquid cooling.
check out new videos on cooltv
cooltv, coolingzone's engineering and science information channel, has videos about the thermal management industry from product demos to webinars.
product & industry news
new ats liquid cold plates with innovative mini-channel design perform 30% better than competitors
advanced thermal solutions, inc. (ats), a leading-edge thermal engineering and manufacturing company focused on the thermal management of...
mentor announces 2017 flotherm award winners for thermal design excellence
mentor, a siemens business, announced its winners for the inaugural annual flotherm award for excellence in electronics thermal design.
tt electronics introduces the lightest, most effective pcb mounted heatsink
tt electronics, a global provider of engineered electronics for performance critical applications, has today announced the wmhp-hs heatsink...
flir introduces thermal by flir program and first four partners
flir systems, inc. announced the thermal by flir program designed for technology partners who use flir thermal imaging sensors and its first four...
intest receives largest order in company history for optical transceiver production test
intest corporation, an independent designer, manufacturer and marketer of thermal management products and semiconductor automatic test equipment...
molex acquires assets of triton manufacturing company, inc.
molex, llc, a global manufacturer of complete interconnect solutions, announced the acquisition of certain assets of triton manufacturing company,...
maysteel industries, llc acquires damac products, llc
maysteel industries, llc, a leading manufacturer of custom, precision, oem sheet metal enclosures, electrical cabinets and metal fabricated...
deepcool introduces quadstellar smart case full tower four cabin
deepcool, the company that specializes in water-cooled and illuminated cases for the pc enthusiast has just introduced quadstellar smart case ?the...
breakthrough tft material from solar-tectic and blue wave semiconductors is patented
solar-tectic llc and blue wave semiconductors, inc. announced that a breakthrough material for dramatically improving the performance of thin-film...
one rock capital partners to acquire robertshaw
one rock capital partners, llc announced that one of its affiliates has signed a definitive agreement to acquire robertshaw holdings s.a.r.l.
technology corner
new zealand professors using 3-d printing to make heat exchangers [coolingzone]
two professors from the university of canterbury (uc) in christchurch, new zealand, conan fee and dr. tim huber, were recently awarded one of the...
estimating internal air cooling temperature reduction in a closed box [electronics-cooling]
an earlier article in this column considered the problem of cooling electronic components in a closed box [1]. in outdoor applications for example,...
euv lithography finally ready for chip manufacturing [ieee spectrum]
the giant machine garnering all this attention is an extreme ultraviolet lithography tool. for more than a decade, the semiconductor-manufacturing...
what can you expect from the new generation of power supplies? [electronics design]
today?s power supplies do more than deliver clean and stable dc power on daily basis?they provide advanced capabilities that can save you time and...
thermal design for outdoor electronic products
outdoor electronic enclosures are prevalent in telecommunications, industrial and military applications. they protect electrical and electronic...
engineering how to
how to manufacture heat sinks with metal injection molding
rapid developments in microprocessor technology have led to a need for the efficient high-volume production of advanced heat sink devices. the metal...
how to apply tec to thermal management of 3-d ics
the advent of vertical chip integration, in recent years, has allowed 3d chips to overcome issues such as delay, bandwidth limitation and power...
how to select a heat sink for cooling electronics
this lecture by haroon junaidi gives an understanding of the basic principles behind heat sink design, how a heat sink works and the basic selection...

conferences & webinars
automotive thermal management conference 2018
feb. 1-2, 2018 in berlin, germany - the conference will bring together all specialists in auto and truck construction with focus on automotive thermal management technology. the automotive thermal management conference 2018 will highlight the challenges, opportunities, and emerging innovations; alternative drive, enhancing...
international conference on thermal engineering theory and applications
february 25 - 28, 2018 - doha, qatar - the conference main objective is to bring together researchers engaged in the application of experimental, analytical, or theoretical thermal and energy engineering. the suggested topics link between conventional and emerging research areas in thermal energy. papers submitted to the...
apec 2018
march 4-8, 2018 - san antonio, texas - the 2018 ieee applied power electronics conference and exposition (apec) focuses on the practical and applied aspects of the power electronics business. the conference addresses issues of immediate and long term importance to practicing power electronics engineer.

you are currently registered to receive coolingzone at: ‹email›

if this email was forwarded to you and you would like to request your own subscription
to coolingzone, subscribe now.

unsubscribe from the coolingzone monthly emagazine here.
click here to unsubscribe.