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Flomerics

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Latest Release of FLO/PCB Features Significant Enhancements
Flomerics Acquires Microelectronics Research & Development Limited (MicReD)
Flopack Version 5 Supports New JEDEC Thermal Testing Standard
Stokes Research Institute Releases Guide to Evaluating Thermal Analysis Software
Application Showcases Downstream Thermal Implications of Component Placement
Flomerics Incorporates Thermal Models of Sunon Fans on SmartParts3D Website
Pace Micro Uses Thermal and EMC Simulation to Boost Hard Drive Life
Thermal Simulation Helps Silicon Graphics Keep Its New Supercomputer Cool
MicReD Offers TERALED Tester for Optical and Thermal LED Measurements
Flomerics to Acquire NIKA GmbH
Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues
APC Uses Airflow Simulation to Solve Data Center Cooling Problem
Simulation Saves Solectron 3 Months and $40,000 in Cooling Outdoor Antenna
Otis Elevator Uses Integrated Analysis to Meet Tough Thermal and EMC Challenges
New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems
Flomerics Announces 2006 Thermal, EMC and Antenna Simulation Training Schedule
“Top 10” IT Company Validates Flo/EMC Simulation Software and Reduces Design Time and Cost
Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market
Flomerics Establishes Thermal Test Lab After T3Ster Acquisition
Flomerics Announces 2006 10-City Seminar and User Group Meetings
NVIDIA Uses Compact Thermal Models to Speed Design of NVIDIA nForce4-based Systems
Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive”
Flomerics Releases PCB Design Survey Highlighting Conflict Between Thermal and SI/EMC Design Requirements
Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability
Computer Simulation Helps Ensure Comfort Inside Exhibition Pavilion
Imbera Optimizes Thermal Design Using Flotherm Software
Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication
Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage
Thermal + EMC Simulation Helps Get IT Infrastructure Products to Market 3-6 Months Faster
Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage
Flomerics Celebrates 20th Anniversary, Validating Concept of Simulation for Non-Specialists
Sarantel Selects MicroStripes 3D Electromagnetic Simulation Software in $620,000 R&D Investment
Flomerics Releases Flovent Version 7 with Unrivalled Design Optimization Capability
Bronswerk Heat Transfer BV Develops Groundbreaking Air-Cooled Coolers and Innovative Fans with Massive Environmental Impact
Airflow Simulation Ensures +/- 1 Degree F Temperature Range in Pharmaceutical Warehouse Preserving Life-Saving Drugs
Flomerics Adds Thermal Models of Sunon “Mighty Mini” Fans to SmartParts3D Website
“Engineering Fluid Dynamics for Education” Offer by Flomerics Attracts Universities and Technical Colleges Worldwide
Flomerics Releases Version 8 of EFD Engineering Fluid Dynamics Analysis Software
Fluid Simulation Reduces Valve Prototype Development Time from 3 Months to 1 Day
Flomerics Releases FLO/PCB Version 4.1
Compare Your Fluid Dynamics IQ to the Average Mechanical Engineer
Flomerics Sells Electromagnetics Business to CST GmbH
Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts
Flomerics joins NAFEMS CFD Working Group
ANCIS Optimizes Data Center Cooling with Flovent CFD Software
Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design
Laser Cutting System from Fico Achieves 40x Performance Enhancement after Engineering Fluid Dynamics Analysis
JAZO Cuts Design Time for Outdoor Transformer Housings
FLOMERICS FURTHER ENHANCES PRODUCTIVITY OF THERMAL DESIGN ENGINEERS WITH FLOPACK VERSION 6.2
New Flovent Diffuser “SmartParts” Improve Airflow Simulation in Buildings

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