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product news
|  | | cts electronics releases fansinks for high temperature applications
cts electronic components announces the addition of fansinks for high temperature applications to its electronic components solutions product...
| |  | | laird technologies features 67 different thermoelectric assemblies for thermal management applications
laird technologies is an industry leader in high-performance, high-quality and highly-efficient thermoelectric assemblies (teas), laird technologies...
| |  | | thermacore highlight on heat pipe assemblies
heat pipe assemblies from thermacore mean that thermal engineers can count on innovative, best-in-class thermal management solutions that offer...
| |  | | cooling source highlights push-pin family of black anodized aluminum pin fin heat sinks
cooling sources cs867 series of black anodized aluminum pin fin heat sinks offer 162 different choices in the family. heights from 9.5mm to 20mm...
| |  | | ansys and nvidia deliver first commercial gpu-accelerated fluid dynamics solver
ansys users can now leverage nvidia graphics processing units (gpus) to speed up fluid dynamics simulation and quickly handle large, complex...
| |  | | emerson network power introduces liebert hpc s freecooling chiller to provide efficient thermal management for small to medium data centers
emerson network power, a business of emerson (nyse: emr) and a global leader in maximizing availability, capacity and efficiency of critical...
| |  | | sanyo denki introduces industry's highest air flow and longest-lasting 92 x 92 x 38 mm high air flow long life fan
sanyo denki co., ltd. has developed and introduced the 92 x 92 x 38 mm high air flow long life fan "san ace 92l" 9lg type. this cooling fan...
| |  | | carbon zebra connector has 500 contact points/inch
fujipoly's 2005 zebra connector is constructed from alternating layers of conductive carbon and non-conductive silicone that are as thin as...
| |  | | eic now offers the protector series electronic enclosures with integrated thermoelectric coolers
eic solutions, inc., a leading manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of...
| |  | | half ton capacity thermoelectric air conditioner
a first in the field of thermoelectric cooling, teca corp. introduces the ahp-6263 model with a half ton of cooling capacity. this is the largest...
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engineering how to
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reviewing key heat pipe design issues
the purpose of this article is to explain basic heat pipe operation, review key heat pipe design issues, and to discuss current heat pipe electronic... |
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conferences & webinars
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semi-therm 30
march 9-13, 2014, san jose, ca the mission of the ieee semiconductor thermal management and measurement symposium or semi-therm is to provide an annual forum for the exchange of latest technical developments in thermal management of electronic devices, components and systems. semi-therm’s mission is accomplished by... |
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itherm 2014
may 27 – 30, 2014 • walt disney world swan & dolphin hotel, lake buena vista (orlando), fl usa - itherm 2014 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. itherm 2014 will be... |
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advancements in thermal management
august 6-7, 2014, denver, co, the conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, ctos and r&d managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal... |
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