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  • Research supports Einstein theorem about how heat moves through solids

    Scientists at the U.S. Department of Energy Oak Ridge National Laboratory (Oak Ridge, Tenn.) have found evidence that shows heat hopping randomly from atom to atom in thermal...
  • Researchers create lightweight, flexible polymer with high thermal conductivity

    Researchers at the Massachusetts Institute of Technology (MIT) in Cambridge have developed a new lightweight, flexible polymer that can conduct heat 10 times better than most...
  • UCLA researchers set new thermal conductivity benchmark with boron arsenide crystals

    There have been a handful of reports coming from colleges across the U.S. about the potential of boron arsenide crystals in thermal management applications and the University...
  • Thermally-conductive crystals could be used to keep computers cool

    Researchers at the University of Texas at Dallas, the University of Illinois at Urbana-Champaign, and the University of Houston (Texas) have created crystals of boron...
  • Research explores thermal capabilities of new ionic liquid-based nanofluids

    In an article from Science Trends, researchers reviewed recent studies of ionanofluids (INF), new heat transfer fluids that consist of nanoparticles suspended in ionic...
  • Researchers develop bulk boron arsenide crystals with high thermal conductivity

    A team of researchers led by the University of Houston (Texas) have developed a method for growing boron arsenide crystals with a thermal conductivity of 1,000 W/mK in sizes...
  • High-powered thermoelectric generator could advance IoT, wearables technology

    Researchers from Waseda University, Osaka University, and Shizuoka University in Japan have announced the development of a novel silicon nanowire thermoelectric generator...
  • Graphene photodetector from UCLA enhances thermal imaging performance

    Researchers at the University of California Los Angeles (UCLA) have taken advantage of the unique properties of graphene to create and enhanced photodetector that works with...
  • Could holey silicon be a breakthrough in electronics cooling

    University of California - Irvine (UCI) scientists have developed holey silicon, a computer chip wafer that has tiny, vertically-etched orifices that channel heat to the...

ATS Announces Live Webinars on Thermal Management of Electronics

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce a series of monthly, online webinars covering different aspects of the thermal management of electronics. details>>

Alpha and Omega Semiconductor Introduces the Newest Generation 25V Technology

Alpha and Omega Semiconductor Limited (AOS), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, introduced the AONX38168, which utilizes the latest 25V N-Channel MOSFET Technology. details>>

ON Semiconductor Announces New Family of Multi-Chip Module PWM Buck Regulators

ON Semiconductor, driving energy efficient innovations, has announced the release of three new highly efficient mid-voltage PWM buck converters. details>>

Inspur Launches Innovative i48 Server Optimized for AI, HPC and NFV

On June 26, in Germany, Inspur launched the innovative i48 server at the International Supercomputing Conference 2018 (ISC18). details>>

LU-VE Group announces the acquisition of Zyklus Heat Transfer Inc.

Zyklus (Jacksonville, Texas) specializes in manufacturing heat exchangers for commercial refrigeration, refrigerated transport and air conditioning. It has inherited a long tradition in this sector and is deeply-rooted in its territory, with a client base of prime importance.A details>>

Nexperia Offers New ESD Protection Series for USB Type-C

Nexperia, the global leader in discretes, logic and MOSFET devices, announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. details>>

ATS announces release of new Engineering eBook, focused on Liquid Cooling

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, has released a new Engineering eBook that covers Liquid Cooling and its Applications in the Thermal Management of Electronics. details>>

ERP Power Introduces Computer Controlled Dimming

ERP Power LLC (ERP), a leading provider of small, smart and connected LED drivers for the lighting industry, today announced the smallest programmable drivers with innovative and disruptive Computer Controlled Dimming technology. details>>

ASUS Creativity Leverages Asetek Gen6 Cooling Solution

In a major step to expand its Republic of Gamers (ROG) ecosystem, ASUS announced at Computex 2018 its first all-in-one (AIO) liquid coolers, the ROG Ryujin and Ryuo. details>>

Kerlink Signs Agreement with Leading Electronics Distributor in Brazil

Kerlink, a specialist and global leader in solutions dedicated to the Internet of Things (IoT), and TCT Brasil, a leading electronics distributor in Brazil, announced that TCT Brasil will distribute Kerlink solutions in that country. details>>

Thermal Energy Acquires Boilerroom Equipment Inc.

Thermal Energy International Inc., a global provider of industrial and institutional energy efficiency solutions, announced that it has acquired all of the outstanding shares of privately held Boilerroom Equipment Inc. based just outside of Pittsburgh, Pa. details>>

ATS and New Yorker Electronics Announce New Distribution Partnership

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, and New Yorker Electronics, a franchised distributor providing products and services to the electronics components industry, are pleased to announce a new distribution partnership. details>>

Wakefield-Vette Honors Digi-Key with Distributor Award

Digi-Key Electronics, a global electronic components distributor, was recognized with the Wakefield-Vette Distributor Award "In Recognition of Highest NPI Revenue Growth" at the 2018 EDS Banquet in Las Vegas, Nev. details>>

Noctua introduces quiet CPU coolers for LGA3647 Intel Xeon platforms

Noctua introduced three quiet CPU coolers for the LGA3647 socket of Intel Xeon Scalable (Platinum, Gold, Silver, Bronze) and Xeon-Phi processors. details>>

Robotic Heat Exchanger Cleaning Technology from Tube Tech International Receives EU Funding

Fouling removal specialist Tube Tech International has received Horizon 2020 SME Instruments funding to develop the next generation of its patented Shell Side Jet solution. details>>

Microsemi SP6LI Package Dedicated to SiC MOSFET Technology

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced its extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules. details>>

Modine Releases 52- and 60-Ton Atherion D-Cabinet HVAC Units

Modine Manufacturing Company, a leader in technology in the HVAC industry, has released the latest additions to their Atherion D-Cabinet line with the new 52- and 60-ton capacity units. details>>

Dana Inaugurates New Facility to Support Automakers with Thermal Management in China

Dana Incorporated inaugurated a facility in Yancheng, China that will manufacture thermal-management products for conventional and new-energy vehicles. details>>

Faurecia Invests in Promethient and Accelerates Development of Thermal Comfort Tech for Cockpits

Faurecia, a leading automotive technology company, announces an investment in the American startup Promethient, reinforcing the ecosystem dedicated to thermal management technologies for future mobility solutions. details>>

Murata IRH DC-DC converters offer high-reliability for industrial and rail applications

The 150-Watt IRH series from Murata Power Solutions provides market-leading power conversion efficiency, in an industry-standard half-brick pinout, using the latest component and packaging technologies in a fixed-frequency switching power supply architecture. details>>

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