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coolingZONE Newsletter for April 5, 2013 April 05, 2013
Top Stories
Design of Liquid Cooled Heat Sinks and Cold Plates
Fundamental Concepts for Transitioning from Air to Liquid Cooling (free pre-recorded lecture)
Uncertainities in Thermal Design
Besides temperature there are a other problems engineers need to be wary of.
Heat Sinks and Heat Exchanger Fin Optimization
Do you know the optimal heat sink fin geometry? What works and what doesn't?
The Thermal Resistance of Microchannel Cold Plates
This paper studies how channel size and material affect cold plate thermal resistance
Product News
Graftech's Wins Another Contract To Provide Thermal Management Solutions For Space Research And Exploration.
GrafTech International today announced that its Engineered Solutions (ES) business segment has won another contract to provide thermal management...
Flow-Flavoring Fin Geometry Highlights Assmann's Industry Leading Led Heat Sinks
ASSMANN WSW components expands their product range by special designed LED heat sinks on the base of extruded and/or die cast technology.
Low-Cost Temperature Transmitters Receives ATEX Certification for Use in Zone 2 Hazardous Locations
ST130 series head-mount transmitters with thermocouple or RTD inputs are now ATEX-approved for use in potentially explosive atmospheres with...
New High-Sensitivity Single-Element Thermopile Sensor For Infrared Detection
The T11262-01 is a high-sensitivity thermopile sensor with a D of 1.3 by 108. It is housed in a compact TO-18 package with a high transmittance...
New Consulting Project Subscription Plan Released by ATS
ATS has released a Consulting Project Subscription Plan (CPSP) for engineering services. The service provides comprehensive thermal management...
JMC Pulse Width Modulation Technology Offers Best In Class Electronics Cooling Fan Regulation
The most efficient method for cooling electronic products is to regulate the fan speed according to the temperature inside the electronic enclosure....
High Flow Vaneaxial Fan For Avionics, Semiconductor, Heat Exchanger And Building Applications
A new vaneaxial fan designed for high performance cooling with powerful airflow has been introduced by AMETEK Rotron. The MAXIAX 9.25 can develop the...
HERMES-AWARD Nomination for Biomaterial Based Diffuser from EBM-Papst
With its revolutionary AxiTop diffuser made of epylen, a wood/plastic composite material, the world market leader ebm-papst has been chosen as one of...
Low Resistance Gold Plated Connector Released from Fujipoly
The Fujypoly Zebra Gold Series 8000B is a high performance, low resistance connector capable of transferring both data and power between parallel...
Technology Corner
Maximum Peformance - Understanding the Heavy Copper Circuit’s Basic Construction [Aerospace Engineering & Design]
The designs of various power electronics products are for a range of every day applications. Increasingly, these projects are taking advantage of a...
Watching fluid flow at nanometer scales [ECN Magazine]
New research carried out at MIT and elsewhere has demonstrated for the first time that when inserted into a pool of liquid, nanowires — wires that...
New ultra-efficient HPC data center debuts [Phys.org]
NREL launches first petascale HPC to use warm-water liquid cooling and reach an annualized average power usage effectiveness (PUE) rating of 1.06 or...
Sun Catalytix Seeks Second Act with Flow Battery (MIT Technology Review]
The MIT spin-off had hoped to enable the hydrogen economy in developing countries, but is now at work on a flow battery using “designer...
Liquid or Air Cooling at the Start of Your Design? A coolingZONE Poll
Our latest poll asks the simple question of if you had a choice between liquid cooling and air cooled thermal management solutions, at the very...
Engineering How To
How to Calculate Spreading Resistance To Optimize Heat Sink Peformance
If heat were evenly spread over the entire large slab area of a heat sink, the source temperature would be lower than what you'll find in this...
An Evaluation of Different Heat Transfer Coefficient Definitions To Help Engineers Choose The Best One for Their Analysis
Three definitions of heat transfer co-effecient are experimentally compared for their accuracy and utility under different conditions of non-uniform...
Heat Sink Selection Made Easy [Pre-Recorded Webinar on Best Methods to Choose a Heat Sink]
How do you go about choosing the right heat sink for your application? What should you consider in your choices? What should you avoid? Dr. Kaveh...









Conferences & Webinars
World Conferences on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics (Portugal, Lisbon | 6-16-2013)
The goal of this conference is to provide a forum for the exposure and exchange of ideas, methods and results in heat transfer, fluid mechanics and thermodynamics.
ASME 2013 Summer Heat Transfer Conference (USA, MN | 7-14-2013)
July 14 - July 19 2013 Minneapolis Minnesota ASME 2013 Summer Heat Transfer Conference, 7th International Conference on Energy Sustainability, and 11th Fuel Cell Science, Engineering and Technology Conference (HTESFUELCELL2013)
Advancements in Thermal Management (USA, CO | 6-6-2013)
The conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
NASA Thermal Fluids and Analysis Workshop
TFAWS is an annual training and professional development workshop designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large.
coolingZONE 13, International Business and Technology Summit (USA, MA | 10-21-2013)
coolingZONE Summit gathers together world re-known experts in thermal management to share their latest developments and research, and discuss emerging technologies for advanced cooling of electronic systems.
Editor's corner
The Building is the New Server
Scott Weiss, a Partner at Andreessen Horowitz, writes in All Things Digital that, "The personal computer is dead. As quickly as we moved from the desktop to the laptop, we are moving to the tablet — never to return. With the death of the PC, an entire ecosystem dies with it. The chipset is ARM-based, rather than Intel. The operating system is all iOS and Android, rather than Windows. The applications are hosted cloud apps like Box, Google Apps and Evernote rather than SharePoint, Office and Outlook." (You can read his full write up here). Scott's statement is provocative and meant to draw you in to the debate but for thermal and mechanical engineers the debate has big implications. Can we scale cooling reliably, cost effectively and environmentally friendly? Do our experience and smarts scale to meet the post-PC challenge of cloud computing? One group that IS thinking beyond heat sinks and airflow (as important as those are) to address cooling data centers (cooling the cloud if you will) is the University of Maryland. One team in particular is considering many aspects of data center capacity, throughput and data type in their considering of thermal management. We'd invite our readers to take a look at their work and let us know. As an engineer are you scaling your thinking about the new server? Please click to read more at, "University of Maryland, Thermal and Energy Management in Datacenters"

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