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coolingZONE Technical Newsletter March 06, 2014
Top Stories
Motivations for Liquid Cooling and Considernig The Right Fluid
A talk from the 2014 Stanford Exascale Conference on server liquid cooling fluid options and more
How to Increase A Fuel Cells Efficiency by 85% with Thermal Management
The energy efficiency of a fuel cell is generally between 40 to 60%, but up to 85% is possible with passive thermal management.
Compliant Cold Plate Technology Review: 1991-2007
Flexible cold plates and cold plates with flexible fins are part of our cold plate patent technology review
Thermal Conductivity of Printed Circuit Boards
What are the key questions to be answered when factoring the PCB into your Electronics Cooling?
coolingZONE News
Save The Date! coolingZONE 2014 Thermal Management eConference
coolingZONE 2014 eConference will be returning for it's 14th year! Save the date for the industries leading eConference on thermal management and...
Align Sourcing Joins coolingZONE's Supplier Directory as Premium Supplier
Align Sourcing offerings consist of standard and custom manufactured thermoelectric modules and assemblies as well as related thermal management...
Sanyo-Denki Posts New White Paper on Fan Reliability
Sanyo-Denki, a Premium Supplier at coolingZONE, has a new white paper out on technology improving fan reliability. You can read it in the Supplier...
Product News
CTS Electronics Releases Fansinks for High Temperature Applications
CTS Electronic Components announces the addition of fansinks for high temperature applications to its Electronic Components Solutions product...
Laird Technologies Features 67 Different Thermoelectric Assemblies For Thermal Management Applications
Laird Technologies is an industry leader in high-performance, high-quality and highly-efficient thermoelectric assemblies (TEAs), Laird Technologies...
Thermacore Highlight on Heat Pipe Assemblies
Heat pipe assemblies from Thermacore mean that thermal engineers can count on innovative, best-in-class thermal management solutions that offer...
Cooling Source Highlights Push-Pin Family of Black Anodized Aluminum Pin Fin Heat Sinks
Cooling sources CS867 series of black anodized aluminum pin fin heat sinks offer 162 different choices in the family. Heights from 9.5mm to 20mm...
ANSYS and NVIDIA Deliver First Commercial GPU-Accelerated Fluid Dynamics Solver
ANSYS users can now leverage NVIDIA graphics processing units (GPUs) to speed up fluid dynamics simulation and quickly handle large, complex...
Emerson Network Power Introduces Liebert HPC S Freecooling Chiller to Provide Efficient Thermal Management for Small to Medium Data Centers
Emerson Network Power, a business of Emerson (NYSE: EMR) and a global leader in maximizing availability, capacity and efficiency of critical...
SANYO DENKI Introduces Industry's Highest Air Flow and Longest-Lasting 92 x 92 x 38 mm High Air Flow Long Life Fan
SANYO DENKI CO., LTD. has developed and introduced the 92 x 92 x 38 mm high air flow long life fan "San Ace 92L" 9LG type. This cooling fan...
Carbon Zebra Connector has 500 Contact Points/Inch
Fujipoly's 2005 Zebra Connector is constructed from alternating layers of conductive carbon and non-conductive silicone that are as thin as...
EIC Now Offers The Protector Series Electronic Enclosures with Integrated Thermoelectric Coolers
EIC Solutions, Inc., a leading manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of...
Half Ton Capacity Thermoelectric Air Conditioner
A first in the field of thermoelectric cooling, TECA Corp. introduces the AHP-6263 Model with a half ton of cooling capacity. This is the largest...
Technology Corner
Engineers Choice at coolingZONE 2014 Thermal Management eConference
coolingZONE 2014 Thermal Management eConference is being held March 20-23, 2014 and the coolingZONE team is looking for our reader's input for...
Graphene conducts electricity ten times better than expected
Physicists have produced nanoribbons of graphene — the single-atom-thick carbon — that conduct electrons better than theory predicted even for...
Infrared: A new renewable energy source?
When the sun sets on a remote desert outpost and solar panels shut down, what energy source will provide power through the night? A battery, perhaps,...
SDSU Mechanical Engineering Department is developing a means of cooling laptops and portable electronic devices more efficiently.
SDSU is investigating tiny flexible pipes that can cool a device while using a minimum amount of power. It's called a pulsating or oscillating heat...
Improve Thermal Efficiency With Enhanced Integrated Motor Technology
Providing maximum cooling within a compact space has always been a challenging task. Over the last decade, a number of highly efficient solutions...
Engineering How To
What is the difference between Typ Power and Max Power for a component?
Which one are engineers supposed to use in CFD thermal simulations, or even estimating junction temperature by hand using the package thermal...
Understanding Bernoulli's Equation in Thermal Management
Bernoulli is about pressure. First we'll clarify on the meaning of pressure before diving into explaining the Bernoulli's equation.
Reviewing Key Heat Pipe Design Issues
The purpose of this article is to explain basic heat pipe operation, review key heat pipe design issues, and to discuss current heat pipe electronic...










Conferences & Webinars
Semi-Therm 30
March 9-13, 2014, San Jose, CA The mission of the IEEE Semiconductor Thermal Management and Measurement Symposium or SEMI-THERM is to provide an annual forum for the exchange of latest technical developments in thermal management of electronic devices, components and systems. SEMI-THERM’s mission is accomplished by...
ITherm 2014
May 27 – 30, 2014 • Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL USA - ITherm 2014 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2014 will be...
Advancements in Thermal Management
August 6-7, 2014, Denver, CO, The conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal...

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