Editorial

• Technology review of recent data center and high-density computer cooling innovations

  In a recent article published by Advanced Thermal Solutions, Inc. (ATS), a leading-edge engineering firm based in Norwood, Mass. focused on the thermal management of electronics, three patents for data center cooling and high-density computing are highlighted. details>>

• New DARPA program seeking thermal management solutions for hypersonic vehicles

  The U.S. Department of Defense (DoD) Defense Advanced Research Projects Agency (DARPA) recently announced that its Materials Architectures and Characterization for Hypersonics (MACH) program is seeking designs and material solutions for cooling hypersonic vehicles. details>>

• Researchers want to reduce energy consumption with high-tech heating patches in clothing

  Researchers at Rutgers University (New Brunswick, N.J.) and Oregon State University (Corvallis, Ore.) have developed a cost-effective method that uses intense pulses of light to fuse silver wires with polyester to fabricate thin heating patches that run on coin batteries and are 70 percent more effective than previous attempts. details>>

• Updated reports give clearer picture of Rivian EV battery design and thermal management

  Reports of electric vehicle (EV) startup Rivian and its new adventure vehicle line with larger battery capacities than any other on the market have already come out, but this week an article from Teslarati reveled greater details about the batteries and the thermal management techniques that Rivian is incorporating. details>>

• New passive air-cooling solution for servers reduces cooling energy by 90 percent with no water

  Forced Physics, a thermal management company that was boosted early on by funding from the U.S. Army Research Laboratories, was recently featured in an article by The Next Platform about its innovative JouleForce Conductor, a passive air-cooling solution for data centers that the company claims will provide 40 percent cost savings and 90 percent cooling power reduction. details>>

• How can high-powered CPUs on dense server boards be effectively air-cooled

  A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering firm based in Norwood, Mass., explains some of the thermal solutions that engineers are using to cool high-powered CPUs in dense server board environments where space and airflow are limited. details>>

• Reports indicate that new Nissan Leaf to debut without liquid cooling for battery

  According to respected German news outlet Electrive.com, the newest version of the electric Nissan Leaf, which has been delayed for months, will feature a 60 kWh battery with a larger DC charging capacity (and a power boost from 110 kW to 149 kW) but will not include a liquid cooling solution to manage battery temperature. details>>

• Researchers looking information on cooling smartphones under heavy sensor processing loads

  According to a report from MilitaryAerospace.com, officials at the U.S. Intelligence Advanced Research Projects Agency (IARPA), based in Washington, D.C., are reaching out to industry experts for information on cooling smartphones when they are used as sensors or in sensor networks and exposed to solar heat. details>>

• EV startup Rivian reveals first all-electric truck and SUV at the L.A. Auto Show

  Rivian, an electric vehicle startup created by engineers from the Massachusetts Institute of Technology (MIT), have revealed its first Electric Adventure Vehicles, an all-electric pickup truck and SUV, during the L.A. Auto Show. details>>

• New Snapdragon 855 mobile platform designed to meet demands of 5G, AI and XR at once

  Qualcomm has announced that its newest generation Snapdragon 855 mobile platform, the first commercial mobile platform to support 5G, artificial intelligence (AI), and extended reality (XR), which will give users extended battery life and improved performance. details>>