Editorial

• Case study explores design of air-to-air heat exchanger

  A case study produced by Advanced Thermal Solutions, Inc. (ATS) explores the analysis and design behind an air-to-air heat exchanger that included heat pipes for an enclosure space. details>>

• Liquid cooling increasingly the solution for cooling high performance computing

  HPC Wire called this moment the "inflection point" for the industry to understand that liquid cooling solutions, whether at the device, rack or even building level, are going to be a necessity to ensure proper performance. details>>

• Element Six launches first electrically conductive CVD diamond heat spreader

  Element Six, a member of The De Beers Group of Companies, announced that it has developed Diafilm ETC700, a new thermal grade of synthetic diamond produced by chemical vapor deposition (CVD). details>>

• Dutch company using servers to provide a hot shower

  Starting in August, 42 households in the Netherlands will enjoy a free shower that is heated by computer servers thanks to a new project from Nerdalize. details>>

• Higher thermal software needs could mean move to the cloud

  As the thermal challenges of modern electronics devices (increased power demands in smaller packages) become more and more difficult to manage for engineers and designs become more and more intricate, there is a corresponding need for more computing power to handle simulations and a closer connection between CFD and CAD (computer-aided design) programs. details>>

• Liquid helium cooling used to break overclocking record on Intel processor

  At a recent Gigabyte event, documented by Extreme Tech, overclockers hit 7.5GHz with an Intel Core i7-7740K Kaby Lake chip on the Skylake-X platform. details>>

• IBM announces the development of transistors for 5 nanometer chips

  At the 2017 Symposia on VLSI Technology and Circuits that took place in Kyoto, Japan in early June, IBM announced that it had partnered with GlobalFoundries and Samsung to build a new type of transistor for chips at the five-nanometer node. details>>

• Celebrate National Thermal Engineer Day on July 24

  Monday, July 24 is an official day of recognition for the hard work and achievements of thermal engineers across the United States. details>>

• Noctua introduces advanced fan design at Computex show

  Austrian cooling components manufacturer Noctua was one of many computer hardware companies to make the trip to Taipei, Taiwan for the annual Computex conference and trade show and while there the company introduced its most advanced fan design to date. details>>

• Rogers Corp. ceramic substrates enhance thermal management

  Rogers Corporation has developed a ceramic substrate that is bonded with copper to provide high heat conductivity with heat capacity and spreading capabilities that can be used in the thermal management of power electronics. details>>